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Volumn 79, Issue 7, 2003, Pages 699-723

Environmental aging effects on thermal and mechanical properties of electrically conductive adhesives

Author keywords

Electrically conductive adhesives; Environmental aging; Irreversible effect; Mechanical properties; Reversible effect; Thermal properties

Indexed keywords

AGING OF MATERIALS; CROSSLINKING; DRYING; DYNAMIC MECHANICAL ANALYSIS; ELECTRIC CONDUCTIVITY; MATHEMATICAL MODELS; MECHANICAL PROPERTIES; PLASTICITY; PYROLYSIS; THERMODYNAMIC PROPERTIES; THERMOGRAVIMETRIC ANALYSIS;

EID: 0042123920     PISSN: 00218464     EISSN: None     Source Type: Journal    
DOI: 10.1080/00218460309575     Document Type: Article
Times cited : (17)

References (38)
  • 1
    • 0043080615 scopus 로고    scopus 로고
    • Liu, Ed.; (Electrochemical Publications LTD, Port Erin, Isle of Man, British Isles); Chap. 11
    • Liu, Ed., Conductive Adhesives for Electronics Packaging (Electrochemical Publications LTD, Port Erin, Isle of Man, British Isles, 1999), Chap. 11, p. 360.
    • (1999) Conductive Adhesives for Electronics Packaging , pp. 360
  • 23
    • 0042579857 scopus 로고    scopus 로고
    • Environmental aging effects on the durability of conductive adhesive joints
    • Xu, S., Dillard, D. A. and Dillard, J. G., Environmental Aging Effects on the Durability of Conductive Adhesive Joints, Submitted to the Int. J. Adhesion and Adhesives.
    • Int. J. Adhesion and Adhesives
    • Xu, S.1    Dillard, D.A.2    Dillard, J.G.3
  • 34
    • 0141987151 scopus 로고    scopus 로고
    • ASTM D638-01; (American Society for Testing and Materials, Philadelphia, PA)
    • ASTM D638-01, Annual Book of ASTM Standards (American Society for Testing and Materials, Philadelphia, PA, 2001).
    • (2001) Annual Book of ASTM Standards
  • 36
    • 0042078778 scopus 로고    scopus 로고
    • Determining the impact resistance of electrically conductive adhesives using a falling wedge test
    • Xu, S. and Dillard, D. A., Determining the impact resistance of electrically conductive adhesives using a falling wedge test, submitted to the IEEE Trans. Comp., Packag., Manufact. Technol.
    • IEEE Trans. Comp., Packag., Manufact. Technol.
    • Xu, S.1    Dillard, D.A.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.