Electrothermomechanical analysis and its application to studying electrically conductive adhesive joints

Journal of Thermal Analysis and Calorimetry

Volumn 74, Issue 1, 2003, Pages 3-11

  Xiao, J ^a,b   Chung, D D L ^a  

^a UNIVERSITY AT BUFFALO   (United States)

^b NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

Author keywords

Conductive adhesive; Electrical resistivity; Epoxy; Silver; Thermal analysis; Thermomechanical analysis

Indexed keywords

ADHESIVE JOINTS; CURING; ELECTRIC CONDUCTIVITY; EPOXY RESINS; HEATING; SILVER; TEMPERATURE; THERMAL CYCLING; THERMODYNAMIC STABILITY;

ELECTROTHERMOMECHANICAL ANALYSIS; MECHANICAL STABILITY;

THERMOANALYSIS;

EID: 0242443276     PISSN: 13886150     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1026356031485     Document Type: Article

References (28)

1. J. Mijovic and T. C. Gsell, SAMPE Quarterly - Society for the Advancement of Materials and Process Engineering, 21 (1990) 42.
2. K. C. Cole, D. Noel, J.-J. Hechler, A. Chouliotis and K. C. Overbury, Polym. Compos., 10 (1989) 150.
3. W.-D. Emmerich and E. Kaisersberger in Materials Science Monographs, Vol. 35, Elsevier, Amsterdam, Neth and New York, 1986, p. 289.
4. W. J. Sichina and P. S. Gill in Tech. Sessions of the 41st Annual Conf. - Reinforced Plastics/Composites Institute, SPI, New York, NY, Sess. 24, 1986, p. 4.
5. J. N. Leckenby, D. C. Harget, W. J. Sichina and P. S. Gill in Carbon Fibers: Technology, Uses and Prospects, Noyes Publ., Park Ridge, NJ 1985, p. 86.
6. J. N. Leckenby, D. C. Harget, W. J. Sichina and P. S. Gill in Carbon Fibers III, Plastics & Rubber Inst., London 1985, p. 11.1.
7. T. W. Johnson and C. L. Ryan in Proc. 31st International SAMPE Symposium and Exhibition 1986, Materials Sciences for the Future, SAMPE, Azusa, CA 1986, p. 1537.
8. D. Wong, J. Jankowsky, M. DiBerardino and R. Cochran in Proc. 38th Int. SAMPE Symp. and Exhibition, SAMPE, Covina, CA, Part 2, 38 (1993) 1552.
9. K. E. Atkinson and C. Jones, J. Adh., 56 (1996) 247.
10. J. L. Jankowsky, D. G. Wong, M. F. DiBerardino and R. C. Cochran in ASTM Special Technical Publication, no. 1249, Proc. Symp. on Assignment of the Glass Transition, ASTM, Philadelphia, PA 1994, p. 277.
11. P. Olivier, J. P. Cottu and B. Ferret, Composites, 26 (1995) 509.
12. A. Licea-Claverie and F. J. U. Carrillo, Polymer Testing, 16 (1997) 445.
13. B. Harris, O. G. Graddell, D. P. Almond, C. Lefebvre and J. Verbist, J. Mater. Sci., 28 (1993) 3353.
14. M. Akay, J. G. Cracknell and H. A. Farnham, Polym. & Polym. Compos., 2 (1994) 317.
15. J. W. E. Gearing and M. R. Stone, Polym. Compos., 5 (1984) 312.
16. J. R. Sarasua and J. Pouyet, J. Thermoplastic Compos. Mater., 11 (1998) 2.
17. D. D. L. Chung, J. Therm. Anal. Cal., 65 (2001) 153.
18. V. Chellappa, Z. W. Chiou and B. Z. Jang, J. Mater. Sci., 30 (1995) 4263.
19. Z. Mei and D. D. L. Chung, Cem. Concr. Res., 30 (2000) 799.
20. G. Airoldi, S. Piredda, M. Pozzi and A. V. Shelyakov, Mater. Sci. Forum, 327 (2000) 135.
21. G. Gomarasca, G. Airoldi and A. V. Shelyakov, J. de Physique. IV:JP, 11 (2001) Pr8339.
22. S. K. Kang and S. Purushothaman, J. Electron. Mater., 28 (1999) 1314.
23. D. Lu, Q. K. Tong and C. P. Wong, IEEE Transactions on Electronics Packaging Manufacturing, 22 (1999) 223.
24. T. Inada and C. P. Wong, Proc. 1998 4th Int. Symp. & Exhib. On Advanced Packaging Materials, Properties & Interfaces, (1998) 268.
25. T. W. Giants, J. Adh. Sci. & Tech., 12 (1998) 593.
26. K. Feldmann and R. Luchs, Surface Mount Tech., 12 (1998) 74, 76, 78.
27. C. P. Wong, D. Lu, L. Meyers, S. A. Vona Jr. and Q. K. Tong in Proc. 1997 1st IEEE Int. Symp. on Polymeric Electronics Packaging, IEEE, Piscataway, NJ 1997, p. 80.
28. M. Zwolinski, J. Hickman, H. Rubin, Y. Zaks, S. McCarthy, T. Hanlon, P. Arrowsmith, A. Chaudhuri, R. Hermansen, S. Lau and D. Napp, IEEE Transactions on Components, Packaging, & Manufacturing Technology. Part C: Manufacturing, 19 (1996) 241.