The effect of functionalized silver on rheological and electrical properties of conductive adhesives

ECS Transactions

Volumn 34, Issue 1, 2011, Pages 811-816

  Fan, Qiong ^a   Cui, Huiwang ^a   Fu, Chune ^a   Li, Dongsheng ^a   Tang, Xin ^a   Yuan, Zhichao ^a   Ye, Lilei ^c   Liu, Johan ^a,b  

^a SHANGHAI UNIVERSITY   (China)

^b CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^c SHT SMART HIGH TECH AB   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

ADIPIC ACIDS; ADSORBED MOLECULES; BULK RESISTIVITY; CONDUCTIVE ADHESIVE; ELECTRICAL CONDUCTIVITY; ELECTRICAL PROPERTY; FUNCTIONALIZED; ISOTROPIC CONDUCTIVE ADHESIVES; MOLECULAR SURFACES; ORGANIC RESINS; SILVER SURFACE; THIOGLYCOLIC ACID; WEIGHT PERCENTAGES;

ADHESIVES; CHEMISORPTION; ELECTRIC CONDUCTIVITY; FUNCTIONAL POLYMERS; RHEOLOGY; SEMICONDUCTOR DEVICE MANUFACTURE; SHEAR VISCOSITY;

SILVER;

EID: 79959656328     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.3567678     Document Type: Conference Paper

References (10)

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