Modeling of smoothening effect on morphologies of annealed submicron nickel particles used for electrically conductive adhesives

Journal of Applied Physics

Volumn 100, Issue 8, 2006, Pages

  Goh, C F ^a   Gan, Z H ^a   Mhaisalkar, S G ^a   Boey, F Y C ^a   Gusak, A M ^b   Teo, P S ^c  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b CHERKASY NATIONAL UNIVERSITY   (Ukraine)

^c INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ANNEALING; COST EFFECTIVENESS; ELECTRIC CONDUCTIVITY; FLIP CHIP DEVICES; MICROELECTRONICS; THERMODYNAMIC STABILITY;

ANNEALED SUBMICRON NICKEL PARTICLES; ELECTRICALLY CONDUCTIVE ADHESIVES; MICROELECTRONIC PACKAGING; NICKEL SURFACE;

NICKEL COMPOUNDS;

EID: 33750518017     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2356790     Document Type: Article

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