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Volumn 100, Issue 8, 2006, Pages
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Modeling of smoothening effect on morphologies of annealed submicron nickel particles used for electrically conductive adhesives
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Author keywords
[No Author keywords available]
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Indexed keywords
ADHESIVES;
ANNEALING;
COST EFFECTIVENESS;
ELECTRIC CONDUCTIVITY;
FLIP CHIP DEVICES;
MICROELECTRONICS;
THERMODYNAMIC STABILITY;
ANNEALED SUBMICRON NICKEL PARTICLES;
ELECTRICALLY CONDUCTIVE ADHESIVES;
MICROELECTRONIC PACKAGING;
NICKEL SURFACE;
NICKEL COMPOUNDS;
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EID: 33750518017
PISSN: 00218979
EISSN: None
Source Type: Journal
DOI: 10.1063/1.2356790 Document Type: Article |
Times cited : (2)
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References (15)
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