Novel fast-curing electrically conductive adhesives from a functional epoxy and micro silver flakes: Preparation, characterization, and humid-thermal aging

Journal of Adhesion

Volumn 89, Issue 9, 2013, Pages 714-726

  Cui, Hui Wang ^a,b   Du, Wen Hui ^a  

^a SHANGHAI UNIVERSITY   (China)

^b NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

Author keywords

Aging; Conductive adhesives; Electronics; Epoxy epoxides

Indexed keywords

CONDUCTIVE ADHESIVE; ELECTRICALLY CONDUCTIVE ADHESIVES; ELECTRONIC PACKAGING; EPOXY/EPOXIDES; FOUR-PROBE METHODS; PRODUCTION EFFICIENCY; REACTIVE DILUENTS; SILANE COUPLING AGENT;

AGING OF MATERIALS; COUPLING AGENTS; CURING; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRONIC EQUIPMENT; ELECTRONICS PACKAGING; ENERGY DISPERSIVE SPECTROSCOPY; FOURIER TRANSFORM INFRARED SPECTROSCOPY; SCANNING ELECTRON MICROSCOPY; SILVER; THERMAL AGING;

ELECTRIC PROPERTIES;

EID: 84876497635     PISSN: 00218464     EISSN: 15455823     Source Type: Journal    
DOI: 10.1080/00218464.2012.757696     Document Type: Article

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