SCOPUS 정보 검색 플랫폼

Volumn 45, Issue 1, 2004, Pages 157-160

New electrically conductive adhesives filled with low-melting-point alloy fillers

(4) Kim, Jong Min a Yasuda, Kiyokazu a Rito, Masahiro b Fujimoto, Kozo a

Author keywords

Conductive path; Contact resistance; Electrically conductive adhesive; Flip chip bonding; Low melting point alloy; Microelectronic; Optoelectronic applications; Reduction capability

Indexed keywords

ADHESIVES; ALLOYS; CROSSLINKING; CURING; DIFFERENTIAL SCANNING CALORIMETRY; FILLERS; OPTICAL MICROSCOPY; POWDERS; RESINS; VOLUME FRACTION;

CROSS SECTIONAL OPTICAL LASER MICROSCOPE; ELECTRICALLY CONDUCTIVE ADHESIVES; LOW MELTING POINT ALLOY FILLERS; METALLURGICAL CONNECTION;

CONDUCTIVE MATERIALS;

EID: 1642296554 PISSN: 13459678 EISSN: None Source Type: Journal
DOI: 10.2320/matertrans.45.157 Document Type: Article

Times cited : (22)

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