Study on the reliability of fast curing isotropic conductive adhesive

ECS Transactions

Volumn 34, Issue 1, 2011, Pages 805-810

  Du, Wenhui ^a   Cui, Huiwang ^a   Chen, Si ^a   Yuan, Zhichao ^a   Ye, Lilei ^b   Liu, Johan ^a,c  

^a SHANGHAI UNIVERSITY   (China)

^b SHT SMART HIGH TECH AB   (Sweden)

^c CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

AGING TIME; BULK RESISTIVITY; CURING DEGREE; CURING TIME; ELECTRONIC PACKAGING; ELECTRONIC PACKAGING INDUSTRY; ENVIRONMENTALLY-FRIENDLY; FAST CURING; HIGH INTEGRATION DENSITY; INTERCONNECT MATERIALS; ISOTROPIC CONDUCTIVE ADHESIVES; LOW PROCESSING TEMPERATURE; MANUFACTURABILITY; PROCESSING CONDITION; SEMICONDUCTOR TECHNOLOGY;

CHIP SCALE PACKAGES; CONCRETE BEAMS AND GIRDERS; CURING; INDEPENDENT COMPONENT ANALYSIS; PROCESSING; SEMICONDUCTOR DEVICE MANUFACTURE; TECHNOLOGY;

RELIABILITY;

EID: 79959629853     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.3567677     Document Type: Conference Paper

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