A highly conductive bimodal isotropic conductive adhesive and its reliability

ECS Transactions

Volumn 34, Issue 1, 2011, Pages 583-588

  Li, Dongsheng ^a   Cui, Huiwang ^a   Chen, Si ^a,b   Fan, Qiong ^a   Yuan, Zhichao ^a   Ye, Lilei ^c   Liu, Johan ^a,b  

^a SHANGHAI UNIVERSITY   (China)

^b CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^c SHT SMART HIGH TECH AB   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

AGING TIME; BULK RESISTIVITY; COPPER SURFACE; ISOTROPIC CONDUCTIVE ADHESIVES; LAP SHEAR STRENGTH; MATRIX RESIN; METAL SURFACES; SCANNING ELECTRONIC MICROSCOPY; SPHERICAL PARTICLE; WEIGHT RATIOS;

ELECTRIC PROPERTIES; FILLERS; RESINS; SEMICONDUCTOR DEVICE MANUFACTURE; SHEAR STRENGTH;

SILVER;

EID: 79959660691     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.3567642     Document Type: Conference Paper

References (8)

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