Using a functional epoxy, micron silver flakes, nano silver spheres, and treated single-wall carbon nanotubes to prepare high performance electrically conductive adhesives

Electronic Materials Letters

Volumn 9, Issue 3, 2013, Pages 299-307

  Cui, Hui Wang ^a,b   Li, Dong Sheng ^a   Fan, Qiong ^a  

^a SHANGHAI UNIVERSITY   (China)

^b OSAKA UNIVERSITY   (Japan)

Author keywords

conductive adhesives; electronic package; nanoparticles

Indexed keywords

BULK RESISTIVITY; CONDUCTIVE ADHESIVE; ELECTRICALLY CONDUCTIVE ADHESIVES; ELECTRONIC PACKAGE; HIGH TEMPERATURE STABILITY; PYROLYSIS TEMPERATURE; REACTIVE DILUENTS; SILANE-COUPLING AGENTS;

ADHESION; BOND STRENGTH (MATERIALS); CARBON NANOTUBES; CURING; EPOXY RESINS; NANOPARTICLES; RESINS; SPHERES;

SILVER;

EID: 84876481558     PISSN: 17388090     EISSN: 20936788     Source Type: Journal    
DOI: 10.1007/s13391-013-2243-y     Document Type: Article

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