Fatigue reliability analysis of Sn-Ag-Cu solder joints subject to thermal cycling

IEEE Transactions on Device and Materials Reliability

Volumn 13, Issue 1, 2013, Pages 36-49

  Che, F X ^a   Pang, John H L ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Fatigue reliability; finite element (FE) modeling; lead free solder; life prediction; thermal cycling (TC)

Indexed keywords

FATIGUE RELIABILITY; FINITE ELEMENT MODELING; INTERMETALLIC COMPOUND THICKNESS; LEAD FREE SOLDERS; LEAD-FREE SOLDER JOINT; LIFE PREDICTIONS; PLASTIC BALL GRID ARRAY PACKAGES; REFERENCE TEMPERATURE;

FATIGUE DAMAGE; FINITE ELEMENT METHOD; RELIABILITY ANALYSIS; SILVER; SOLDERING ALLOYS; THERMAL CYCLING; TIN;

ELECTRONICS PACKAGING;

EID: 84874970756     PISSN: 15304388     EISSN: 15582574     Source Type: Journal    
DOI: 10.1109/TDMR.2012.2195007     Document Type: Article

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