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Journal of Electronic Materials

Volumn 39, Issue 1, 2010, Pages 77-84

Multiscale simulation of microstructural changes in solder interconnections during thermal cycling

(3) Li, J a Mattila, T T a Kivilahti, J K a

a AALTO UNIVERSITY (Finland)

Author keywords

Finite element method; Monte Carlo method; Recrystallization; Reliability

Indexed keywords

CYCLIC THERMAL LOADING; EXPERIMENTAL OBSERVATION; FE MODEL; INCUBATION PERIODS; LIFETIME PREDICTION; MICROSTRUCTURAL CHANGES; MONTE CARLO; MULTI-SCALE SIMULATION; MULTISCALE METHOD; NONUNIFORM; NUCLEATION MODELS; RECRYSTALLIZATION; RECRYSTALLIZATIONS; RECRYSTALLIZED MICROSTRUCTURES; SOLDER INTERCONNECTIONS; STORED ENERGY DISTRIBUTION;

GRAIN BOUNDARIES; GRAIN GROWTH; GRAIN SIZE AND SHAPE; MATHEMATICAL MODELS; MICROSTRUCTURE; MONTE CARLO METHODS; RECRYSTALLIZATION (METALLURGY); THERMAL CYCLING;

FINITE ELEMENT METHOD;

EID: 74449084245 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-009-0957-2 Document Type: Article

Times cited : (21)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.