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Volumn 50, Issue 1, 2010, Pages 116-126

A reliability model for SAC solder covering isothermal mechanical cycling and thermal cycling conditions

Author keywords

[No Author keywords available]

Indexed keywords

CALIBRATED MODEL; CYCLIC FREQUENCY; CYCLIC LOADING CONDITIONS; DATA SETS; LIFE CYCLE PREDICTION; LOAD DROPS; MATERIAL BEHAVIOUR; MEAN TEMPERATURE; MECHANICAL CYCLING; MODEL CONSTANTS; RELIABILITY MODEL; SAC-SOLDERS; SEMI-EMPIRICAL APPROACH; SINGLE PARAMETER; SOLDER INTERCONNECTS; TEST DATA; TESTING APPARATUS;

EID: 72449159551     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2009.08.008     Document Type: Article
Times cited : (57)

References (28)
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.