Three-dimensional effects of solder joints in micro-scale bga assembly

Journal of Electronic Packaging, Transactions of the ASME

Volumn 121, Issue 4, 1999, Pages 297-302

  Zhu, J ^a  

^a NOKIA RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0347718219     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2793856     Document Type: Article

References (13)

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2. Darveaux, R„ 1997, “Solder Joint Fatigue Life Model,” presented at the 1997 Metallurgical Society Annual Meeting, Orlando, FL, February 9-13, 1997.
3. Darveaux, R„ and Banerji, K., 1992, “Constitutive Relations for Tin-Based Solder Joints,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 15, No. 6, December, pp. 1013-1024.
4. Lau, J. H., and Pao, Y. H„ 1997, Solder Joint Reliability ofBGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies, McGraw-Hill, New York.
5. Liu, D. R., and Jairazbhoy, V. A., 1998, “Metal Screen Sandwiched solder joints for Long Thermal Cycling Life,” paper presented at the 1998 International Mechanical Engineering Congress & Exposition, Anaheim, CA, (98-WA/EEP-3), Nov. 1520.
6. Liu, S., 1992, “Damage Mechanics of Cross-Ply Laminates Resulting from Transverse Concentrated Loads,” Ph.D. thesis, Mechanical Engineering Dept., Stanford University, CA.
7. Mukai, M., Kawakami, T., Takahashi, K., Iwasaki, K„ and Kishimoto, K., 1997, “Thermal Fatigue Life of Solder Bumps in BGA,” presented at the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference (Inter-PACK’97), Kohala Coast, Hawaii, June 15-19.
8. Simon, B. R., Yuan, Y., Umaretiya, J. R., Prince, J. L., and Staszak, Z. J., 1989, “Parametric Study of a VLSI Plastic Package Using Locally Refined Finite Element Models,” Proceedings, Fifth IEEE SEMI-THERM Symposium, pp. 52-58.
9. Simon, B. R., Yuan, Y., Umaietiya, J. R., Bavirisetty, R., and Prince, J. L., 1990, “Thermal and Mechanical Finite Element Analysis of a VLSI Package Including Spatially Varying Thermal Contact Resistance," Proceedings, Sixth IEEE SEMITHERM Symposium, pp. 74-81.
10. Stennett, M., Bonnell, R., and Villarreal, J., 1992, “Reliability Enhancement for Large Brazed Pin Ceramic Modules (Modeling and Assembly Process Modifications),” Proceedings, 1992 International Symposium on Microelectronics, San Francisco, CA, Oct. 19-21, pp. 643-647.
11. Zhu, J., 1996, “Modeling and Validation of Thermally-Induced Failure Mechanisms in Microelectronic Packaging,” Ph.D. dissertation, Mechanical Engineering Department, Wayne State University, Detroit, MI.
12. Zhu, J., Ojala, K., and Tuominen, A., 1997, “The Application of Global/Local Technique Infinite Element Simulation of BGA Assemblies,” presented at the ASME International Mechanical Engineering Congress & Exposition (97-WA/EEP-5), Dallas, Texas, Nov. 16-21.
13. Zhu, J., 1999, “3-D Parametric FEA Models Of Electronic Packages,” presented at the 1999 International Mechanical Engineering Congress and Exhibition, Nashville, TN.