Simplification of finite element models for thermal fatigue life prediction of PBGA packages

Journal of Electronic Packaging

Volumn 125, Issue 3, 2003, Pages 347-353

  Akay, Hasan U ^a   Liu, Yan ^a   Rassaian, Mostafa ^b  

^a Indiana University Purdue University Indianapolis   (United States)

^b BOEING COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL GEOMETRY; COMPUTER SIMULATION; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; NUMERICAL METHODS; SURFACE MOUNT TECHNOLOGY; THREE DIMENSIONAL;

PLASTIC BALL GRID ARRAY; SOLDER JOINTS; THERMAL FATIGUE LIFE;

ELECTRONICS PACKAGING;

EID: 0141918651     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1569956     Document Type: Article

References (16)

1. Akay, H. U., Paydar, N. H., and Bilagic, A., 1997, "Fatigue Life Predictions for Thermally Loaded Solder Joints Using a Volume-Weighted Averaging Technique," ASME J. Electron. Packag., 119, pp. 228-235.
2. Akay, H. U., Zhang, H., and Paydar, N. H., 1997, "Experimental Correlation of an Energy-Based Fatigue Life Prediction Method for Solder Joints," Proc. ASME InterPACK'97, pp. 1567-1574.
3. Akay, H. U., Kaliappan, G., Paydar, N. H., and Rassaian, M., 1999, "A Study of Fatigue Life Predictions for PBGA Joints and Comparisons with Test Data," Proc., ASME InterPACK'99, pp. 677-684.
4. Yao, Q., and Qu, J., 1999, "Effects of PWB Size on the Warpage of Flip Chip Assemblies," Proc., ASME InterPACK'99, pp. 27-31.
5. Sakai, H., Ito, N., Kawase, K., Imamura, K., Ohno, M., and Motegi, M., 1999, "Thermal Fatigue Life Evaluation for The Solder Joint Ceramic BGA," Proc., ASME InterPACK'99, pp. 255-261.
6. Lee, S. R., Newman, K., and Hu, L., 2000, "Thermal Fatigue Analysis of PBGA Solder Joints with the Consideration of Damage Evolution," Packaging of Electronic and Photonic Devices, ASME, pp. 207-212.
7. Ternes, R., and Hauch, R., 2000. "Test Methodologies for Reliability Testing of Small Plated-Through Holes (Vias) and/or Ball Grid Array (BGA) Solder Joints," The Boeing Company.
8. Syed, A. R., 1995, "Creep Crack Growth Prediction of Solder Joints During Temperature Cycling - An Engineering Approach," ASME J. Electron. Packag., 117, June, pp. 116-112.
9. Paydar, N., Tong, Y., and Akay, H. U., 1994, "A Finite Element Study of Factors Affecting Fatigue Life of Solder Joints," ASME J. Electron. Packag., 116, pp. 265-273.
10. Lam, S. T., Arieli, A., and Mukherjee, A. K., 1979, "Superplastic Behavior of Pb-Sn Eutectic Alloy," Mater. Sci. Eng., 40, pp. 73-79.
11. Kaliappan, G., 1999. "A Comparative Evaluation of Fatigue Life Prediction Methods for Solder Joint Assemblies," Master of Science thesis, Purdue University.
12. Skipor, A., Harren, S., and Botsis, J., 1995, "Constitutive Characterization of 63/37 Sn/Pb Eutectic Solder Using the Bodner-Partom Unified Creep-Plasticity Model," Advances in Electronic Packaging, 117, pp. 130-135.
13. ABAQUS, User's Manual, Hibbitt, Karlsson and Sorenson, Inc., Version 6.1, 2001.
14. Dasgupta, A., Oyan, D., and Pecht, M., 1992, "Solder Creep-Fatigue Analysis by an Energy-Partitioning Approach," ASME J. Electron. Packag., 114, pp. 152-160.
15. Wen, L.C., Mon, G.R., and Ross, R.G. Jr., 1994, "Reliability Assessment of Solder Joints on LLCC Packages," jet Propulsion Laboratory Report No. JP D-11920, Pasadena, CA.
16. Lau, J., Gowalkar, S., Suratt, R., and Boysan, P., 1992, "Experimental and Analytical Studies of 28-pin Thin Small Outline Package (TSOP) Solder-Joint Reliability," ASME J. Electron. Packag., 144, pp. 118-121.