Real-time warpage measurement of electronic components with variable sensitivity

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 975-980

  Verma, K ^a   Columbus, D ^a   Han, B ^a   Chandran, B ^b  

^a CLEMSON UNIVERSITY   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ENVIRONMENTAL CHAMBERS; INTERFEROMETRY; RELIABILITY; THERMAL CYCLING;

EARLY STAGE OF PRODUCT DEVELOPMENT; ELECTRONIC COMPONENT; ELECTRONICS DEVICES; ENHANCED SENSITIVITY; FIZEAU INTERFEROMETRY; MANUFACTURING PROCESS; REAL TIME MEASUREMENTS; THERMALLY INDUCED WARPAGE;

NETWORK COMPONENTS; ELECTRONICS PACKAGING;

FAR INFRARED FIZEAU INTERFEROMETRY; PLASTIC BALL GRID ARRAYS (PBGA); SHADOW MOIRE; WARPAGE MEASUREMENTS;

EID: 0031628845     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678827     Document Type: Conference Paper

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