SCOPUS 정보 검색 플랫폼

Volumn 40, Issue 6, 2011, Pages 1409-1415

Characterizing the mechanical properties of actual SAC105, SAC305, and SAC405 solder joints by digital image correlation

(3) Nguyen, T T a Yu, D a Park, S B a

a State University of New York (United States)

Author keywords

BGA; DIC; Lead free solder; mechanical properties; SAC; solder joint

Indexed keywords

BGA; DIC; LEAD FREE SOLDERS; SAC; SOLDER JOINT;

FINITE ELEMENT METHOD; IMAGE ANALYSIS; POISSON RATIO; SILVER; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING ALLOYS; STRAIN; STRAIN MEASUREMENT; THERMAL EXPANSION; TIN ALLOYS;

TIN;

EID: 79955893228 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-011-1534-z Document Type: Article

Times cited : (57)

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