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Volumn 25, Issue 2, 2002, Pages 100-106
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Thermomechanical reliability of underfilled BGA packages
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Author keywords
BGA; Delamination; Reliability; Solder joint fatigue; Underfill
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Indexed keywords
DELAMINATION;
FATIGUE OF MATERIALS;
FINITE ELEMENT METHOD;
INTERFACES (MATERIALS);
RELIABILITY;
RESIDUAL STRESSES;
SOLDERED JOINTS;
STRAIN;
STRESS ANALYSIS;
THERMAL CYCLING;
THERMAL EFFECTS;
THERMOMECHANICAL TREATMENT;
BALL GRID ARRAYS (BGA);
UNDERFILLS;
CHIP SCALE PACKAGES;
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EID: 0036545254
PISSN: 1521334X
EISSN: None
Source Type: Journal
DOI: 10.1109/TEPM.2002.1021634 Document Type: Article |
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Times cited : (18)
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References (9)
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