Effect of finite element modeling techniques on solder joint fatigue life prediction of flip-chip BGA packages

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 972-980

  Fan, Xuejun ^a   Pei, Min ^b   Bhatti, Pardeep K ^a  

^a INTEL CORPORATION   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE ELEMENT MODELING; GLOBAL/LOCAL MODELING; SOLDER ALLOYS; STRESS FREE TEMPERATURE SETTING;

COMPUTER SIMULATION; ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; THERMAL CYCLING;

SOLDERED JOINTS;

EID: 33845590598     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645772     Document Type: Conference Paper

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