Effect of constant and cyclic current stressing on the evolution of intermetallic compound layers

Journal of Electronic Materials

Volumn 40, Issue 7, 2011, Pages 1517-1526

  Laurila, T ^a   Karppinen, J ^a   Vuorinen, V ^a   Paul, A ^b   Paulasto Krockel M ^a  

^a AALTO UNIVERSITY   (Finland)

^b INDIAN INSTITUTE OF SCIENCE   (India)

Author keywords

Electromigration; Intermetallic reactions; Lead free solder; Solid state diffusion

Indexed keywords

CATHODE AND ANODE; CONSTANT CURRENT; CONSTANT TEMPERATURE; CURRENT-STRESSING; CYCLIC POWER; ELECTRON FLUX; GROWTH BEHAVIOR; INTERFACIAL REACTION LAYER; INTERMETALLIC COMPOUND LAYER; INTERMETALLIC REACTION; LEAD FREE SOLDERS; PARTIAL MELTING; SOLDER INTERCONNECTIONS; SOLID-STATE DIFFUSION; STEADY-STATE CURRENTS;

DIFFUSION IN SOLIDS; ELECTRIC LOAD FORECASTING; ELECTROMIGRATION; LEAD COMPOUNDS; SOLDERED JOINTS; SOLDERING ALLOYS; TIN;

INTERMETALLICS;

EID: 80051585912     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-011-1632-y     Document Type: Article

References (26)

1. C.-M. Chen and S.-W. Chen, J. Appl. Phys. 90, 1208 (2001).
2. H. Gan and K.N. Tu, J. Appl. Phys. 97, 3514 (2005).
3. B. Chao, S. Chae, X. Zhang, K. Lu, J. Im, and P.S. Ho, Acta Mater. 55, 2805 (2007).
4. L. Wang, F. Wu, J. Zhang, B. An, and Y.Wu, Proceedings of 2004 International Conference on the Business of Electronics Product Reliability and Liability, April 27-30, 2004, Shanghai, Everbright, China (IEEE, 2004), p. 47.
5. Y. Lin, Y. Hu, C. Tsai, C.R. Kao, and K.N. Tu, Acta Mater. 53, 2020 (2005).
6. C. Tsai, Y. Lin, J. Tsai, Y.-S. Lai, and C.R. Kao, J. Electron. Mater. 35, 1005 (2006).
7. S.-W. Chen and C.-M. Chen, JOM 55, 62 (2003).
8. K. Yamanaka, Y. Tsukada, and K. Suganuma, Scr. Mater. 55, 867 (2006).
9. K. Yamanaka, Y. Tsukada, and K. Suganuma, Microelectr. Reliab. 47, 1280 (2007).
10. L. Xu, J.-K. Han, J. Liang, K.N. Tu, and Y.-S. Lai, Appl. Phys. Lett. 92, 2621 (2008).
11. B. Chao, X. Zhang, S.-H. Chae, and P. Ho, Microelectr. Reliab. 49, 253 (2009).
12. T. Laurila, T. Mattila, V. Vuorinen, J. Karppinen, J. Li, M. Sippola, and J.K. Kivilahti, Microelectr. Reliab. 47, 1135 (2007).
13. P.H. Sun and M. Ohring, J. Appl. Phys. 47, 479 (1976).
14. P. Singh and M. Ohring, J. Appl. Phys. 56, 899 (1984).
15. J. Dekker, A. Lodder, and J. van Ek, Phys. Rev. B 56, 12167 (1997).
16. M. Oh (Doctoral Dissertation, Lehigh University, 1994).
17. B. Dyson, T. Anthony, and D. Turnbull, J. Appl. Phys. 38, 3408 (1967).
18. P. Ho and T. Kwok, Rep. Prog. Phys. 52, 301 (1989).
19. A. Paul, Doctoral thesis, Technical University of Eindhoven, (2004).
20. T. Laurila, V. Vuorinen, and M. Paulasto-Kröckel, Mater. Sci. Eng. R68, 1 (2010).
21. V. Vuorinen, T. Laurila, T. Mattila, E. Heikinheimo, and J. Kivilahti, J. Electron. Mater. 36, 1355 (2007).
22. J. Hurtig (Master's Thesis, Helsinki University of Technology, 2006).
23. T. Laurila, J. Hurtig, V. Vuorinen, and J.K. Kivilahti, Microelectr. Reliab. 49, 242 (2009).
24. A. Paul, C. Ghosh, and W. Boettinger, Metall. Mater. Trans. A, 42A, 952 (2011).
25. K.N. Tu, Acta Metall. 21, 347 (1973).
26. K.N. Tu and R. Thompson, Acta Metall. 30, 947 (1982).