Modeling the failure of intermetallic/solder interfaces

Intermetallics

Volumn 18, Issue 8, 2010, Pages 1603-1611

  Yao, Yao ^a   Keer, Leon M ^b   Fine, Morris E ^b  

^a EXXONMOBIL UPSTREAM RESEARCH COMPANY   (United States)

^b Northwestern University   (United States)

Author keywords

A. Intermetallics; B. Fatigue resistance and crack growth; B. Thermoelectric properties; Crack; E. Electronic structure, calculation; E. Mechanical properties, theory; Electrical current; Finite element; Interface; Intermetallic; Joule heating; Solder

Indexed keywords

A. INTERMETALLICS; B. FATIGUE RESISTANCE AND CRACK GROWTH; E. ELECTRONIC STRUCTURE, CALCULATION; E. MECHANICAL; ELECTRICAL CURRENT; FATIGUE RESISTANCE AND CRACK GROWTH; FINITE ELEMENT; INTERFACE; THERMOELECTRIC PROPERTIES;

BALL GRID ARRAYS; BRITTLE FRACTURE; CRACK TIPS; CREEP; CURRENT DENSITY; DUCTILE FRACTURE; ELECTRIC NETWORK ANALYSIS; ELECTRIC PROPERTIES; ELECTRONIC PROPERTIES; ELECTRONIC STRUCTURE; ELECTRONICS INDUSTRY; ELECTRONICS PACKAGING; EUTECTICS; FAILURE ANALYSIS; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; FORECASTING; HEATING; INTERMETALLICS; JOULE HEATING; LEAD; MECHANICAL PROPERTIES; PLASTICITY; QUALITY ASSURANCE; SILVER; SOLDERING ALLOYS; THERMOELECTRIC EQUIPMENT; THREE DIMENSIONAL;

TIN;

EID: 77953651251     PISSN: 09669795     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.intermet.2010.04.016     Document Type: Article

References (29)

1. Mattila T.T., and Kivilahti J.K. J Elec Mat 35 (2006) 250
2. Zhang L., Ou S., Huang J., and Tu K.N. Appl Phys Lett 88 (2006) 012106
3. Ghosh G. J Mater Res 19 (2004) 5
4. McDowell D.L., Miller M.P., and Brooks D.C. Fatigue Elec Mat ASTM STP 1153 (1994) 42
5. Wen S., Keer L.M., and Mavoori H. J Elec Mat 30 (2001) 1190
6. Abdul-Baqi A., Schreurs P.J.G., and Geers M.G.D. Int J Solids Struc 42 (2005) 927
7. Yang B., Mall S., and Ravi-Chandar K. Int J Solids Struc 38 (2001) 3927
8. Roe K.L., and Siegmund T. Eng Fracture Mech 70 (2003) 209
9. Nguyen O., Repetto E.A., Ortiz M., and Radovitzky R.A. Int J Fracture 110 (2001) 351
10. Yang Q.D., Shim D.J., and Spearing S.M. Microelectronic Eng 75 (2004) 85
11. Towashiraporn P., Subbarayan G., and Desai C.S. Int J Solids Struc 42 (2005) 4468
12. Cavalli M.N., Thouless M.D., and Yang Q.D. Welding J 83 (2004) 133
13. Yu H., Mhaisalkar S.G., Wong E.H., Teh L.K., and Wong C.C. IEEE Trans Comp Packag Tech 29 (2006) 71
14. Yao D.P., and Shang J.K. IEEE Trans Comp Packag Manufac Tech 19 (1996) 154
15. Prager W. J Appl Mech Trans Am Soc Mech Eng 23 (1956) 49
16. Wen S. PhD. Dissertation, Dept. Mech. Eng., Northwestern Univ., Evanston, IL; 2001.
17. Vaynman S., and McKeown S.A. IEEE Trans Comp Hybrids Manufac Tech 16 (1993) 317
18. ABAQUS documentation 6.8.1; 2008.
19. Benzeggagh M.L., and Kenane M. Compos Sci Tech 56 (1996) 439
20. NIST database for solder properties, Release 4.0; 2002.
21. Lau J.H. IEEE Trans 19 (1996) 4
22. Ren F., Nah J.W., Tu K.N., Xiong B.S., Xu L.H., and Pang J.H.L. Appl Phys Lett 89 (2005) 141914
23. Chan Y.C., Tu P.L., So A.C.K., and Lai J.K.L. IEEE Trans Comp Packag Manufac Tech 20 (1997) 4
24. Xu L.H., Pang J.H.L., Ren F., and Tu K.N. J Elec Mat 35 (2006) 2116
25. Alam M.O., Wu B.Y., Chan Y.C., and Tu K.N. Acta Mater 54 (2006) 613
26. Ye H., Basaran C., and Hopkins D. Appl Phys Lett 82 (2003) 7
27. Nah J.W., Suh J.O., and Tu K.N. J Appl Phys 98 (2005) 013715
28. Liang S.W., Shao T.L., Chen C.Y., Everett C.C., and Tu K.N. J Mater Res 21 (2006) 137
29. Chiu S.H., Liang S.W., Chen C., Yao D.J., and Hsu C.Y. Appl Phys Lett 88 (2006) 022110