Isothermal cyclic bend fatigue test method for lead-free solder joints

Journal of Electronic Packaging

Volumn 129, Issue 4, 2007, Pages 496-503

  Pang, John H L ^a   Che, F X ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Cyclic bend test; Fatigue model; Lead free solder; Sn Ag Cu

Indexed keywords

CYCLIC LOADS; HIGH TEMPERATURE EFFECTS; MATHEMATICAL MODELS; SOLDERED JOINTS; STRAIN MEASUREMENT; STRESS ANALYSIS; TIN ALLOYS;

CYCLIC BEND TESTS; LEAD FREE SOLDERS;

FATIGUE TESTING;

EID: 38749103133     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2809442     Document Type: Article

References (13)

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