Thermal cycling fatigue model development for FBGA assembly with Sn-Ag-based lead-free solder

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2008, Pages

  Che, Fa Xing ^a   Luan, Jing En ^a   Yap, Daniel ^a   Goh, Kim Yong ^a   Baraton, Xavier ^a  

^a STMicroelectronic ^*  (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC PACKAGE; FATIGUE LIFE MODEL; FATIGUE MODEL; FINE PITCH BGA; FINITE ELEMENT SIMULATIONS; GOOD CORRELATIONS; KNOW-HOW; LEAD FREE SOLDERS; LIFE MODELS; LOADING CONDITION; MICROELECTRONIC ASSEMBLY; NI-DOPED; SAC-SOLDERS; SIMULATION RESULT; SN-AG-CU; SN-AG-CU-NI; SOLDER ALLOYS; SOLDER JOINTS; THERMAL CYCLING TEST; THERMAL FATIGUE-LIFE;

COMPUTER SIMULATION; DOPING (ADDITIVES); FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; LEAD; MATHEMATICAL MODELS; MICROELECTRONICS; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; STATISTICAL PROCESS CONTROL; THERMAL CYCLING; TIN ALLOYS;

TIN;

EID: 77955102625     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMT.2008.5507875     Document Type: Conference Paper

References (9)

1. Amagai, M., et al, "Mechanical Characterization of Sn-Ag-based Lead-free Solders", Microelectronics Reliability 42 (2002), pp. 951-966.
2. Pang, H.L.J. et al, "Bulk Solder and Solder Joint Properties for Lead Free 95.5Sn-3.8Ag-0.7Cu Solder Alloy", Proc 53rd Electronic Components and Technology Conf, 2003, pp. 673-679.
3. Terashima, S. et al, "Effect of Silver Content on Thermal Fatigue Life of Sn-xAg-0.5Cu Flip-chip Interconnects", Journal of Electronic Materials, Vol. 32 No. 12 (2003), pp. 1527-1533.
4. Kim, K.S., Huh, S.H., and Suganuma, K., "Effect of Fourth Additive on Microstructures and Tensile Properties of Sn-Ag-Cu Alloy and Joints with Cu", Microelectronics Reliability 43 (2003), pp. 259-267.
5. Amagai, M., Toyoda, Y., and Tajima, T., "High Solder Joint Reliability with Lead Free Solders", Proc 53rd Electronic Components and Technology Conf, 2003, pp. 317-322.
6. Che, F.X., Luan, J.E., Baraton, X., "Effect of Silver Content and Nickel Dopant on Mechanical Properties of Sn-Ag-based Solders", Proc 58th Electronic Components and Technology Conf, May 27-30, 2008, pp. 485-490.
7. th Electronic Packaging Technology Conf, Singapore, Dec. 2004, pp. 787-792
8. Che, F.X., and Pang, H.L.J. et al, "Modeling Constitutive Model Effect on Reliability of Lead-Free Solder Joints", Proc ICEPT 2006, Shanghai, 27-29 Aug. 2006, pp. 155-160.
9. Che, F.X., and Pang, H.L.J. et al, "Development and Assessment of Global-Local Modeling Technique Used in Advanced Microelectronic Packaging", Proc EuroSimE 2007, Apr. 15-18, London, UK. pp. 375-381.