Impact of fatigue modeling on 2nd level joint reliability of BGA packages with SnAgCu solder balls

Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

Volumn 2, Issue , 2005, Pages 857-862

  Stoeckl, Stephan ^a   Yeo, Alfred ^b   Lee, Charles ^b   Pape, Heinz ^a  

^a INFINEON TECHNOLOGIES AG   (Germany)

^b INFINEON TECHNOLOGIES ASIA PACIFIC PTE LTD   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; THERMAL CYCLING; TIN ALLOYS;

BALL GRID ARRAY (BGA) PACKAGES; JOINT RELIABILITY; SOLDER BALLS;

SOLDERED JOINTS;

EID: 33847314671     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)

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