Creep and fatigue characterization of lead free 95.5Sn-3.8Ag-0.7Cu solder

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2004, Pages 1333-1337

  Pang, John H L ^a   Xiong, B S ^a   Low, T H ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

COEFFICIENT OF THERMAL EXPANSION (CTE); LEAD FREE SOLDERS; VIDEO EXTENSOMETERS;

ACTIVATION ENERGY; CREEP TESTING; DILATOMETERS; ELECTRONICS PACKAGING; FATIGUE TESTING; LEAD; MATHEMATICAL MODELS; MICROELECTRONICS; PRINTED CIRCUIT BOARDS; RESIDUAL STRESSES; STRAIN RATE; THERMAL EFFECTS; THERMAL EXPANSION; THERMOCOUPLES; TIN ALLOYS;

SOLDERING ALLOYS;

EID: 10444234289     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

1. Shi X.Q., Wang Z.P., Zhou W., H.L.J. Pang and Q.J. Yang, A New Creep Constitutive Model for Eutectic Solder Alloy, Journal of Electronic Packaging, June 2002, pp85-90.
2. Shi X.Q., Pang H.L.J., Zhou W., Wang Z.P., Low Cycle Fatigue Analysis of Temperature and Frequency Effects in Eutectic Solder Alloy, International Journal of Fatigue, 2000, pp217-228.
3. Shi X.Q., Pang H.L.J., Zhou W., Wang Z.P., A Modified Energy-Based Low Cycle Fatigue Model for Eutectic Solder Alloy, Scripta Material, Vol. 41, No. 3, 1999, pp289-296.
4. M.R. Harrison, J.H. Vincent, A.A.H. Steen, Lead-free reflow soldering for electronics assembly, Soldering and Surface Mount Technology, 13(2001), pp21.
5. Edwin Bradley et. al., NEMI Pb-free Task Group Report, 2002 APEX Free Forum January 23, 2002, National Electronics Manufacturing Initiative, Inc.
6. J.W. Morris, H.G. Song and Fay Hua, Creep Properties of Sn-rich Solder Joints, 53th ECTC, New Orlearns, Louisiana USA May 27-30, 2003, Proceedings of IEEE ECTC Conference(2003), pp.54.
7. John Lau, W. Dauksher and P. Vianco, Acceleration Models, Constitutive Equations, and Reliability of Lead-Free Solders and Joints, 53th ECTC, New Orlearns, Louisiana USA May 27-30, 2003, Proceedings of IEEE ECTC Conference(2003), pp.229.
8. John H.L. Pang, B.S. Xiong, C.C. Neo, X.R. Zhang, and T.H. Low, Bulk Solder and Solder Joint Properties for Lead-Free Solder 95.5Sn-3.8Ag-0.7Cu Solder Alloy, 53th ECTC, New Orlearns, Louisiana USA May 27-30, 2003, Proceedings of IEEE ECTC Conference(2003), pp.673.
9. L.F. Coffin, Jr., ASME Trans, 76, 931,1954.
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