The effects of underfill and its material models on thermomechanical behaviors of a flip chip package

IEEE Transactions on Advanced Packaging

Volumn 24, Issue 1, 2001, Pages 17-24

  Chen, Liu ^a   Zhang, Qun ^a   Wang, Guozhong ^a   Xie, Xiaoming ^a   Cheng, Zhaonian ^a  

^a SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY   (China)

Author keywords

Flip chip package; Thermal cycling; Underfill; Viscoelastic

Indexed keywords

ADHESION; COMPUTER SIMULATION; CRACK INITIATION; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; PLASTIC DEFORMATION; SOLDERED JOINTS; STRAIN; THERMAL CYCLING; THERMAL EXPANSION; TIN ALLOYS; VISCOPLASTICITY;

COEFFICIENT OF THERMAL EXPANSION; COFFIN-MANSON TYPE EQUATION; PLASTIC STRAIN; THERMAL FATIGUE;

ELECTRONICS PACKAGING;

EID: 0035248513     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.909620     Document Type: Article

References (17)

1. The future of microelectronics and photonics and the role of mechanics and materials
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15. Fatigue of 60/40 solder
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