Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling

Journal of Materials Research

Volumn 26, Issue 16, 2011, Pages 2103-2116

  Chen, Hongtao ^a,b   Mueller, Maik ^c   Mattila, Tonu Tuomas ^a   Li, Jue ^a   Liu, Xuwen ^a   Wolter, Klaus Juergen ^c   Paulasto Kröckel, Mervi ^a  

^a AALTO UNIVERSITY   (Finland)

^b HARBIN INSTITUTE OF TECHNOLOGY   (China)

^c DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Fatigue; Microstructure; Soldering

Indexed keywords

ELECTRON BACK SCATTER DIFFRACTION; INTER-METALLIC PARTICLE; LEAD FREE SOLDERS; MICROSTRUCTURAL CHANGES; RECRYSTALLIZED GRAINS; SCANNING ELECTRONIC MICROSCOPY; SOLDER INTERCONNECTIONS; STRAIN CONCENTRATION;

CRACKS; ELASTICITY; FAILURE (MECHANICAL); FATIGUE OF MATERIALS; GRAIN BOUNDARIES; MICROSTRUCTURE; NANOINDENTATION; RECRYSTALLIZATION (METALLURGY); SOLDERING; STRAIN; STRUCTURAL DESIGN; THERMAL CYCLING;

CRYSTAL MICROSTRUCTURE;

EID: 82955164451     PISSN: 08842914     EISSN: 20445326     Source Type: Journal    
DOI: 10.1557/jmr.2011.197     Document Type: Article

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