Three-dimensional versus two-dimensional finite element modeling of flip-chip packages

Journal of Electronic Packaging, Transactions of the ASME

Volumn 121, Issue 3, 1999, Pages 196-201

  Yao, Q ^a   Qu, J ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0345761131     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792684     Document Type: Article

References (13)

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10. Qu, J., 1993, “Effects of Slightly Weakened Interfaces on the Overall Elastic Properties of Composite Materials,” Mechanics of Materials, Vol. 14, pp. 269-281.
11. Schubert, A., et al., 1997, “Materials Mechanics and Mechanical Reliability of Flip Chip Assemblies on Organic Substrates,” Proceedings, International Symposium on Advanced Packaging Materials, pp. 106-109.
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13. Wesselmann, C., 1996, “Flip Chip Off the Dime?,” Advanced Packaging, March/April, pp. 7.