Reliability of lead-free BGA assembly: Correlation between accelerated ageing tests and FE simulations

IEEE Transactions on Device and Materials Reliability

Volumn 8, Issue 3, 2008, Pages 449-454

  Guédon Gracia, Alexandrine ^a   Woirgard, Eric ^a   Zardini, Christian ^a  

^a Ecole Nationale Superieure d'Electronique Informatique et Radiocommunications de Bordeaux   (France)

Author keywords

Accelerated ageing tests; Acceleration coefficient (AC); Finite element simulations; Lead free solder joint; Reliability of BGA assemblies

Indexed keywords

BALL GRID ARRAYS; LEAD-FREE SOLDERS; OSCILLATORS (ELECTRONIC); RELIABILITY; SOLDERED JOINTS; STRAIN ENERGY; TESTING; THERMAL CYCLING;

ACCELERATED AGEING TESTS; ACCELERATION COEFFICIENTS; FINITE ELEMENT SIMULATIONS; LEAD-FREE SOLDER JOINT; RELIABILITY OF BGA ASSEMBLIES;

FINITE ELEMENT METHOD;

EID: 54949131377     PISSN: 15304388     EISSN: 15304388     Source Type: Journal    
DOI: 10.1109/TDMR.2008.2000895     Document Type: Article

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