Inhomogeneous deformation and microstructure evolution of Sn-Ag-based solder interconnects during thermal cycling and shear testing

Microelectronics Reliability

Volumn 52, Issue 6, 2012, Pages 1112-1120

  Chen, Hongtao ^a   Han, Jing ^a   Li, Jue ^b   Li, Mingyu ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

^b AALTO UNIVERSITY   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

HIGH ANGLE GRAIN BOUNDARIES; INHOMOGENEOUS DEFORMATION; LOCALIZED DEFORMATIONS; MICROSTRUCTURAL CHANGES; MICROSTRUCTURE EVOLUTIONS; ORIENTATION IMAGING MICROSCOPY; RECRYSTALLIZED MICROSTRUCTURES; ROOM TEMPERATURE; SHEAR TESTING; SN GRAINS; SOLDER INTERCONNECTS;

DEFORMATION; MICROSTRUCTURE; RECRYSTALLIZATION (METALLURGY); SILVER; THERMAL CYCLING;

TIN;

EID: 84862822140     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2012.01.009     Document Type: Article

References (35)

1. K.N. Tu Solder joint reliability: materials, properties, and reliability 2007 Springer Science+Business Media LLC New York
2. M. Abtew, and G. Selvaduray Mater Sci Eng R 27 2000 95
3. T. Laurila, V. Vuorinen, and J.K. Kivilahti Mater Sci Eng R 49 2005 1
4. A.U. Telang, T.R. Bieler, J.P. Lucas, K.N. Subramanian, L.P. Lehman, and Y. Xing J Electron Mater 33 2004 1412
5. Chiu TC, Zeng K, Strierman R, Edwards D, Ano K. In: Proceedings of the 54th electronic components and technology conference; 2004. p. 1256-62.
6. D.W. Henderson, J.J. Woods, T.A. Gosselin, J. Bartelo, D.E. King, and T.M. Korhonen J Mater Res 19 2004 1608
7. Dunford S, Canumalla S, Viswanadham P. In: Proceedings of the 54th electronic components and technology conference; 2004. p. 726-36.
8. S. Terashima, and M. Tanaka Mater Trans 45 2004 681
9. T.T. Mattila, V. Vuorinen, and J.K. Kivilahti J Mater Res 19 2004 3214
10. S. Terashima, K. Takahama, M. Nozaki, and M. Tanaka Mater Trans 45 2004 1383
11. H.T. Chen, M. Mueller, T.T. Mattila, J. Li, X.W. Liu, and K.-J. Wolter J Mater Res 26 2011 2103
12. H.T. Chen, J. Han, and M.Y. Li J Electron Mater 40 2011 2470
13. T.T. Mattila, and J.K. Kivilahti IEEE T Compon Packag Technol 33 2010 629
14. J.J. Sundelin, S.T. Nurimi, and T.K. Lepistö Mater Sci Eng A 474 2008 201
15. A.U. Telang, T.R. Bieler, A. Zamiri, and F. Pourboghrat Acta Mater 55 2007 2265
16. B. Zhou, T.R. Bieler, T.K. Lee, and K.C. Liu J Electron Mater 39 2010 2669
17. H.T. Chen, L. Wang, J. Han, M.Y. Li, and Q.B. Wu J Electron Mater 40 2011 2445
18. Miettinen S. Lyijyttömien juoteliitosten uudelleenkiteytyminen. Master's thesis, Espoo; 2005. 84p.
19. M.A. Matin, W.P. Vellinga, and M.G.D. Geers Mater Sci Eng A 445-446 2007 73
20. S.B. Park, R. Dhakal, and J. Gao J Electron Mater 37 2008 1139
21. L.P. Lehman, Y. Xing, T.R. Bieler, and E.J. Cotts Acta Mater 58 2010 3546
22. A.U. Telang, and T.R. Bieler Scripta Mater 52 2005 1027
23. R.D. Doherty, D.A. Hughes, F.J. Humphreys, J.J. Jonas, D. Juul Jensen, and M.E. Kassner Mater Sci Eng A 238 1997 219
24. F.J. Humphreys J Mater Sci 36 2001 3833
25. E.A. Brandes, and G.B. Brook Smithells metals reference book 7th ed 1992 Butterworth-Heinemann Oxford, (UK)
26. I. Dutta J Electron Mater 32 2003 201
27. J.C.M. Li J Appl Phys 33 1962 2958
28. S.K. Seo, M.G. Cho, and H.M. Lee J Mater Res 25 2010 1950
29. D. Hardwick, C.M. Sellars, and W.J.McG. Tegart J Inst Metals 90 1961 21
30. P. Bastien, P. Azou, and C.R. Acad Sci Paris 232 1951 1845
31. W.T. Nachtrab, and Y.T. Chou J Mater Sci 19 1984 2136
32. M. Cohen Trans Jpn lnst Met 11 1970 145
33. A.H. Cottrell, and B.A. Bilby Proc Phys Soc London A62 1949 49
34. T. Watanabe, and S. Tsurekawa Acta Mater 47 1999 4171
35. U. Krupp Fatigue crack propagation in metals and alloys 2007 Wiley-VCH Verlag GmbH & Co. KgaA Weinheim