CBGA solder joint reliability evaluation based one lastic-Plastic-Creep analysis

Journal of Electronic Packaging, Transactions of the ASME

Volumn 122, Issue 3, 2000, Pages 255-261

  Pang, John H L ^a   Seetoh, C W ^a   Wang, Z P ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0040489198     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.1286120     Document Type: Article

References (11)

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2. Corbin, J. S., 1993, “Finite Element Analysis for Solder Ball Connect (SBC) Structural Design Optimization,” IBM J. Res. Dev., 37, No. 5, Sept., pp. 585-596.
3. Guo, Yifan, and Corbin, J. S., 1995, “Reliability of Ceramic Ball Grid Array Assembly,” Chapter 8 of Ball Grid Array Technology, J. Lau, ed., McGraw-Hill, NY.
4. Barker, D. B., Gupta, V. K., and Cluff, K., 1993, “Solder Joint Crack Initiation and Crack Propagation in a TSOP using Strain Energy Partitioning,” ASME Adv. Electron. Packag., EEP-Vol. 4-2 pp. 943-949.
5. Mukai, M., Kawakami, T., Endo, T., Hiruta, Y., and Takahashhi, K., 1994, “Elastic-Creep Thermal Stress Analyses for the SMT-PGA Package’s Solder Joint,” ASME Mech. Mater. Electron. Packag., Vol. 2—Thermal and Mechanical Behaviour and Modelling, 2 pp. 197-203.
6. Shiratori, M., Yu, Q., Wang, S. B., 1995, “A Computational and Experimental Hybrid Approach to Creep-Fatigue Behavior of Surface-Mounted Solder Joints,” ASME Adv. Electron. Packag., EEP-Vol. 10-1, pp. 451-457.
7. Pang, H. L. J., Kwok, Y. T., and SeeToh, C. W., 1997, “Temperature Cycling Fatigue Analysis of Fine Pitch Solder Joints,” ASME Adv. Electron. Packag., EEP-Vol. 19-2, pp. 1495-1500.
8. Solomon, H. D., 1986, “Fatigue of 60/40 Solder,” IEEE Trans. Compon., Hybrids, Manuf. Technol., 9, No. 4, pp. 423-432.
9. Lau, J. H., 1991, Solder Joint Reliability, Van Nostrand Reinhold.
10. Akay, H. U., Tong, Y., and Paydar, N., 1993, “Thermal Fatigue Analysis of a SMT Solder Joint Using Non-Linear FEM Approach,” Int. J. Microcircuits Electron. Packag., 16, No. 2, pp. 79-88.
11. Darveaux, R., and Banerji, K., 1992, “Constitutive Relations for Tin-based Solder Joints,” IEEE Trans. Compon., Hybrids, Manuf. Technol., 15, No. 6, pp. 1013-1024.