SCOPUS 정보 검색 플랫폼

European Physical Journal D

Volumn 64, Issue 2-3, 2011, Pages 427-435

Growth and properties of Ti-Cu films with respect to plasma parameters in dual-magnetron sputtering discharges

(8) Stranak, V a Wulff, H a Bogdanowicz, R a Drache, S a Hubicka, Z b Cada, M b Tichy, M c Hippler, R a

a UNIVERSITY OF GREIFSWALD (Germany)

b INSTITUTE OF PHYSICS (Czech Republic)

c CHARLES UNIVERSITY (Czech Republic)

Author keywords

[No Author keywords available]

Indexed keywords

BINARY ALLOYS; COPPER; COPPER ALLOYS; COPPER METALLOGRAPHY; CRYSTALLITES; DISTRIBUTION FUNCTIONS; IONS; MAGNETRON SPUTTERING; METALLIC FILMS; TITANIUM ALLOYS; TITANIUM METALLOGRAPHY; X RAY CRYSTALLOGRAPHY; X RAY DIFFRACTION ANALYSIS; X RAY PHOTOELECTRON SPECTROSCOPY;

CHEMICAL COMPOSITIONS; DUAL MAGNETRON SPUTTERING; ION VELOCITY DISTRIBUTION FUNCTION; PLASMA PARAMETER; PULSED DISCHARGE; SATURATED CURRENT; SUBSTRATE POSITIONS; X-RAY REFLECTOMETRY;

THIN FILMS;

EID: 80755128162 PISSN: 14346060 EISSN: 14346079 Source Type: Journal
DOI: 10.1140/epjd/e2011-20393-7 Document Type: Article

Times cited : (31)

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