Experimental determination of stress distributions under electroless nickel bumps and correlation to numerical models

IEEE Sensors Journal

Volumn 11, Issue 11, 2011, Pages 2711-2717

  Lemke, Benjamin ^a   Baskaran, Rajashree ^b   Ganapathysubramanian, Shankar ^b   Paul, Oliver ^a  

^a UNIVERSITY OF FREIBURG   (Germany)

^b INTEL CORPORATION   (United States)

Author keywords

Finite element modeling; high spatial resolution; in situ monitoring; piezo FET; piezoresistive stress sensors; stress mapping; stress sensor array; under bump metallization (UBM)

Indexed keywords

FINITE ELEMENT MODELING; HIGH SPATIAL RESOLUTION; IN SITU MONITORING; PIEZO-FET; PIEZORESISTIVE STRESS SENSORS; STRESS SENSOR ARRAY; UNDER BUMP METALLIZATION;

ARCH BRIDGES; COMPUTER SIMULATION; FINITE ELEMENT METHOD; MESFET DEVICES; PASSIVATION; SENSOR ARRAYS; SILICON NITRIDE; STRESS CONCENTRATION; STRESS MEASUREMENT;

NICKEL;

EID: 80054863116     PISSN: 1530437X     EISSN: None     Source Type: Journal    
DOI: 10.1109/JSEN.2011.2157488     Document Type: Article

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