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Volumn , Issue , 2003, Pages 1222-1229

UBM integrity studies on copper/low-k dielectrics for fine pitch flip chip packaging

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; COPPER; DIELECTRIC MATERIALS; ELECTROLESS PLATING; ELECTRON MICROSCOPY; FAILURE ANALYSIS; FLIP CHIP DEVICES; METALLIZING; OPTICAL MICROSCOPY; THERMODYNAMIC STABILITY;

EID: 0038688848     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (11)

References (8)
  • 2
    • 0038414343 scopus 로고    scopus 로고
    • Anatomy of a breakthrough: How copper came of age
    • IBM Research
    • IBM Research, "Anatomy of a breakthrough: How copper came of Age", Vol. 35, No.4, 1997
    • (1997) , vol.35 , Issue.4
  • 3
    • 0037738242 scopus 로고    scopus 로고
    • Assembly & Packaging Update, International Technology Roadmap for Semiconductors
    • Assembly & Packaging Update, International Technology Roadmap for Semiconductors, 2001.
    • (2001)
  • 6
    • 0000741863 scopus 로고    scopus 로고
    • Electron microscopy study of interfacial reaction between eutectic SnPb and Cn/Ni(V)/A1 thin film metallization
    • Liu C.Y., Tu K.N. Sheng T.T., Tung C.H. Frear D.R., Eleniu P., "Electron Microscopy study of interfacial reaction between eutectic SnPb and Cn/Ni(V)/A1 thin film metallization", J. Appl. Phys., Vol.87, No. 2 (2000), pp.750-754
    • (2000) J. Appl. Phys. , vol.87 , Issue.2 , pp. 750-754
    • Liu, C.Y.1    Tu, K.N.2    Sheng, T.T.3    Tung, C.H.4    Frear, D.R.5    Eleniu, P.6
  • 8
    • 0036505639 scopus 로고    scopus 로고
    • Investigation of flip chip under bump metallization systems of Cu pads
    • March
    • J-W. Nah and K-W. Paik, "Investigation of Flip Chip Under Bump Metallization Systems of Cu Pads", IEEE Transactions on Components and Packaging Technologies, Vol.25, No.1, March 2002, pp32-37.
    • (2002) IEEE Transactions on Components and Packaging Technologies , vol.25 , Issue.1 , pp. 32-37
    • Nah, J.-W.1    Paik, K.-W.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.