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Volumn , Issue , 2003, Pages 1222-1229
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UBM integrity studies on copper/low-k dielectrics for fine pitch flip chip packaging
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Author keywords
[No Author keywords available]
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Indexed keywords
AGING OF MATERIALS;
COPPER;
DIELECTRIC MATERIALS;
ELECTROLESS PLATING;
ELECTRON MICROSCOPY;
FAILURE ANALYSIS;
FLIP CHIP DEVICES;
METALLIZING;
OPTICAL MICROSCOPY;
THERMODYNAMIC STABILITY;
FINE PITCH FLIP CHIP PACKAGING;
UNDER BUMP METALLURGY;
ELECTRONICS PACKAGING;
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EID: 0038688848
PISSN: 05695503
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (11)
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References (8)
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