CMOS sensor chip with a 10x10 array of unit cells for mapping five stress components and temperature

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2010, Pages 604-607

  Baumann, Marc ^a   Gieschke, Pascal ^a   Lemke, Benjamin ^a   Paul, Oliver ^a  

^a UNIVERSITY OF FREIBURG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ABSOLUTE TEMPERATURES; APPLICATION EXAMPLES; CMOS PROCESSS; CMOS SENSORS; IN-PLANE NORMAL STRESS; IN-PLANE SHEAR; LINEAR COMBINATIONS; MECHANICAL STRESS; NORMAL STRESS; OUT-OF-PLANE SHEAR; SIMULTANEOUS MEASUREMENT; STRESS COMPONENT; STRESS DISTRIBUTION; TEMPERATURE MAPPING; UNIT CELLS;

MECHANICAL ENGINEERING; MECHANICS; REACTIVE ION ETCHING; SHEAR STRESS; STANDARDIZATION; STRENGTH OF MATERIALS; STRESS CONCENTRATION;

CMOS INTEGRATED CIRCUITS;

EID: 77952787192     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2010.5442336     Document Type: Conference Paper

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