Delta-sigma based CMOS stress sensor with RF output

2006 IEEE Asian Solid-State Circuits Conference, ASSCC 2006

Volumn , Issue , 2006, Pages 243-246

  Chen, Yonggang ^a   Jaeger, Richard C ^a   Suhling, Jeffrey C ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FREQUENCY SHIFT KEYING; MODULATORS; SENSORS; SIGNAL PROCESSING; SIGNAL RECEIVERS; TRANSISTORS;

DELTA-SIGMA BASED CMOS STRESS SENSOR; PMOS CURRENT MIRROR;

CMOS INTEGRATED CIRCUITS;

EID: 34250854092     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ASSCC.2006.357896     Document Type: Conference Paper

References (18)

1. J. C. Suhling and R. C. Jaeger, "Silicon piezoresistive stress sensors and their application in electronic packaging," IEEE Sensors Journal, vol. 1, no. 1, pp. 14-30, 2001.
2. H. Miura, M. Kitano, A. Nishimura, and S. Kawai, "Thermal stress measurement in silicon chips encapsulated in IC plastic packages under thermal cycling," Journal of Electronic Packaging, vol. 115, no. 1, pp. 9-15, 1993.
3. R. C. Jaeger, J. C. Suhling, M. T. Carey, and R. W. Johnson, "A piezoresistive sensor chip for measurement of stress in electronic packaging," Proceedings of the 43rd Electronic Components and Technology Conference, pp. 686-692, 1993.
4. H. Miura, A. Nishimura, S. Kawai, and G. Murakami, "Structural effect of IC plastic package on residual stress in silicon chips," Proceedings of the 40th Electronic Components and Technology Conference, vol. 1, pp. 316-321, 1990.
5. H. Miura, A. Nishimura, S. Kawai, and K. Nishi, "Development and application of the stress sensing test chip for IC plastic packages," Proceedings of the 64th Annual Meeting of the Japanese Society of Mechanical Engineering, pp. 1826-1832, 1987.
6. R. C. Jaeger, R. Ramani, J. C. Suhling, and Y. Kang, "CMOS stress sensor circuits using piezoresistive field-effect transistors (PIFETs)," Digest of Technical Papers. Symposium on VLSI Circuits, pp. 43-44, 1995.
7. R. C. Jaeger, J. C. Suhling, R. Ramani, A. T. Bradley, and J. Xu, "CMOS stress sensors on (100) silicon," IEEE Journal of Solid-State Circuits, vol. 35, no. 1, pp. 85-95, 2000.
8. A. Sutor, R. Lerch, H.-P. Hohe, and M. Gavesi, "New CMOScompatible mechanical shear stress sensor," IEEE Sensors Journal, vol. 1, no. 4, pp. 345-351, 2001.
9. M. Doelle, C. Peters, P. Ruther, and O. Paul, "Piezo-FET Stress-Sensor Arrays for Wire-Bonding Characterization," Journal of Microelectromechanical Systems, vol. 15, no. 1, pp. 120-130, 2006.
10. Y. Kanda, "Effect of stress on germanium and silicon p-n junctions," Japanese Journal of Applied Physics, vol. 6, no. 4, pp. 475-486, 1967.
11. J. F. Creemer and P. J. French, "Anisotropy of the piezojunction effect in silicon transistors," Proceedings of the Fifteenth IEEE International Conference on Micro Electro Mechanical Systems, pp. 316-319, 2002.
12. F. Fruett and G. C. M. Meijer, "Experimental investigation of piezojunction effect in silicon and its temperature dependence," Electronics Letters, vol. 37, no. 22, pp. 1366-1367, 2001.
13. A. K. M. A. Mian, "Application of the van der Pauw structure as a piezoresistive stress sensor," PhD Dissertation, Auburn University, 2000.
14. J. Xu, "CMOS piezoresistive stress sensors on (111) silicon," PhD Dissertation, Auburn University, Aubum2000.
15. st Siberian Russian Student Workshops on Electron Devices and Materials, no. 5-7782-0291-1, pp. 111-118, 2000.
16. Y. Kanda and A. Yasukawa, "Hall-effect devices as strain and pressure sensors," Sensors and Actuators, vol. 2, pp. 283-296, 1981.
17. Y. Kanda and M. Migitaka, "Effect of mechanical stress on the offset voltages of Hall devices in Si IC," Phys Status Solidi (A) Appl Res, vol. 35, no. no. 2, pp. k115-k118, 1976.
18. R. C. Jaeger, J. C. Suhling, Y. Chen, S. Rahaman, and M. N. Islam, "A Chip-On-Beam Calibration Technique for Piezoresistive Stress Sensor Die," Proceedings of Interpack03, Paper # 35276, pp. 1-8, July, 2003.