Stresses from flip-chip assembly and underfill: Measurements with the ATC4.1 assembly test chip and analysis by finite element method

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1997, Pages 134-143

  Peterson, David W ^a   Sweet, James N ^a   Burchett, Steven N ^a   Hsia, Alex ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; FINITE ELEMENT METHOD; PRINTED CIRCUIT BOARDS; SEMICONDUCTOR DEVICE MANUFACTURE; SOLDERING; STRESSES; SUBSTRATES;

FLIP CHIP SOLDER ATTACH (FPA);

FLIP CHIP DEVICES;

EID: 0030714913     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)