SCOPUS 정보 검색 플랫폼

Volumn 42, Issue 2, 2002, Pages 265-283

Interconnecting to aluminum- and copper-based semiconductors (electroless-nickel/gold for solder bumping and wire bonding)

(3) Strandjord, Andrew J G a Popelar, Scott a Jauernig, Christine a

a IC Interconnect (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ALUMINUM; CATALYST ACTIVITY; COPPER; ELECTROLESS PLATING; FAILURE ANALYSIS; FLIP CHIP DEVICES; GOLD; NICKEL; PALLADIUM; SHEAR STRENGTH; SOLDERING;

WIRE BONDING;

MICROELECTRONICS;

EID: 0036472813 PISSN: 00262714 EISSN: None Source Type: Journal
DOI: 10.1016/S0026-2714(01)00236-0 Document Type: Article

Times cited : (66)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.