Continuous in-situ die stress measurements during thermal cycling accelerated life testing

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 1478-1489

  Rahim, M Kaysar ^a   Roberts, Jordan ^a   Suhling, Jeffrey C ^a   Jaeger, Richard C ^a   Lall, Pradeep ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC PACKAGING GEOMETRIES; FAILURE CRITERIA; LIFE TESTING; THERMAL CYCLING CONFIGURATIONS;

FAILURE MODES; INTERFACES (MATERIALS); MATHEMATICAL MODELS; STRESS MEASUREMENT; THERMAL CYCLING; THERMOMECHANICAL TREATMENT;

ELECTRONICS PACKAGING;

EID: 35348841447     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373991     Document Type: Conference Paper

References (14)

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