Fine pitch low-cost bumping for flip chip technology

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1999, Pages 127-130

  Lu, Szu Wei ^a   Uang, Ruoh Huey ^a   Chen, Kuo Chuan ^a   Hu, Hsu Tien ^a   Kung, Ling Chen ^a   Huang, Hsin Chien ^a  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; INTEGRATED CIRCUIT MANUFACTURE; LEAD; SOLDERING; SURFACE MOUNT TECHNOLOGY; TIN;

SOLDER BUMPS; STENCIL PRINTING;

FLIP CHIP DEVICES;

EID: 0033323381     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)