Comparative study of micro-EGA reliability under bending stress

IEEE Transactions on Advanced Packaging

Volumn 23, Issue 4, 2000, Pages 750-756

  Tu, P L ^b   Chan, Y C ^a,b   Hung, K C ^b   Lai, Joseph K L ^b  

^a IEEE

^b CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Cyclic bending; Fatigue failure; Intermetallic compound; Micro BGA; Reliability; Solder joint

Indexed keywords

BENDING (DEFORMATION); CHIP SCALE PACKAGES; FAILURE ANALYSIS; FATIGUE OF MATERIALS; INTERMETALLICS; PRINTED CIRCUIT BOARDS; RELIABILITY; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS; STRESS ANALYSIS; SURFACE MOUNT TECHNOLOGY; THERMAL CYCLING;

CYCLIC BENDING; MICROBALL GRID ARRAYS; RELIABILITY TEST;

ELECTRONICS PACKAGING;

EID: 0034316055     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.883768     Document Type: Article

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