Theoretical and experimental Raman spectroscopy study of mechanical stress induced by electronic packaging

IEEE Transactions on Components and Packaging Technologies

Volumn 28, Issue 3, 2005, Pages 484-492

  Chen, Jian ^a,b   De Wolf, Ingrid ^a  

^a IMEC   (Belgium)

^b Melexis   (Belgium)

Author keywords

Eutectic bonding; Finite element (FE) simulation; Flip chip; Raman spectroscopy; Solder bumps; Thermo mechanical stress

Indexed keywords

COMPUTER SIMULATION; EUTECTICS; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; RAMAN SPECTROSCOPY; SOLDERING; STRESS ANALYSIS;

EUTECTIC BONDING; SOLDER BUMPS; THERMOMECHANICAL STRESS;

CHIP SCALE PACKAGES;

EID: 27644492993     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2005.848574     Document Type: Article

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