Wafer Bumping Technology for LDI Application by Electroless Nickel Plating

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2003, Pages 319-322

  Kim, J D ^a   Kim, Y N ^a   Lee, J W ^a   Park, J H ^a   Kim, H G ^a   Kim, J O ^a  

^a Samsung Advanced Institute of Technology (SAIT)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; CHEMICAL BONDS; LIQUID CRYSTAL DISPLAYS; METALLIZING; PASSIVATION; ALUMINUM COATINGS; CONVERGENCE OF NUMERICAL METHODS; COSTS; INDUSTRIAL ELECTRONICS; MANUFACTURE; NICKEL; OPTICAL MICROSCOPY; SOLDERING; TEMPERATURE; THICKNESS MEASUREMENT;

WAFER BUMPING TECHNOLOGY;

ELECTROLESS PLATING; WAFER BONDING;

ALUMINUM BOND PADS; ELECTROLESS NICKEL LAYER; ELECTROLESS NICKEL PLATING; HEIGHT DISTRIBUTION; LOW-COST WAFER BUMPING; OPTIMUM PROCESS CONDITIONS; STABILIZER CONCENTRATION; UNDER BUMP METALLIZATION;

EID: 0141788703     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. Davies E., et al, Solid State Technology:Versitile, High Performance Microelectronics, IBM J.Rev.Dev.(April, 1964), pp. 102-114.
2. Lau, J. H., High Performance MicroelectronicsChip-Level Interconnects: Wire bonds and Solder Bumps: Low Cost Flip Chip Technologies, McGraw-Hill (New York, 2000), pp. 27-90.
3. Oppert, T., Zakel, E., Teutsch, T., "A Roadmap to Low Cost Flip Chip and CSP using Electroless Ni/Au," Proc of the Int'l Electronics Manufacturing Tech Symp(IEMT), Omiya, Japan, April 1998, pp. 15-17.
4. Goodman, T. W., and Vardaman, E. J., FCIP and Expanding Markets for Flip Chip, Techsearch International, Inc., (Texas, 1997), pp. 12-50.
5. Vardaman, E. J., Matthew, L., Flip Chip and Wafer Level Packaging Market Analysis, Techsearch International, Inc., (Texas, 2003), pp. 9-32.
6. Riedel, W., Electroless Nickel Plating, ASM International, (Ohio, 1991), pp. 9-31.
7. Kim, J.-D., Kim, Y.-N., Lee, J.-W., and Park, J.-H., "Bump characteristics of electroless nickel/gold for LDI devices", Internal Technical Report in Samsungtechwin Co. Ltd, (Changwon, 2002).
8. Chen, X., Yi, J., Qi, G. and Liu F., "Electroless Nickel Bath for Wafer Bumping: Influence of Additives", Proc of the Int'l Symp on Electronic Materials & Packaging, 2000, pp.12-17.