Residual stress and interfacial reaction of the electroplated Ni-Cu alloy under bump metallurgy in the flip-chip solder joint

Journal of Electronic Materials

Volumn 33, Issue 9, 2004, Pages 948-957

  Kim, S H ^a,c   Kim, J Y ^a   Yu, J ^a   Lee, T Y ^b  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Hanbat National University   (South Korea)

^c Korea Institute of Machine and Materials   (South Korea)

Author keywords

Alloy electroplating; Alloy UBM; Ball shear strength; Electroplating; Flip chip; Interfacial reaction; Lead free solder; Residual stress; Under bump metallurgy (UBM)

Indexed keywords

CRYSTALLIZATION; CURRENT DENSITY; ELECTROPLATING; EVAPORATION; FLIP CHIP DEVICES; LATTICE CONSTANTS; NICKEL ALLOYS; REACTION KINETICS; RESIDUAL STRESSES; TENSILE STRESS; THICKNESS MEASUREMENT;

ALLOY ELECTROPLATING; BALL SHEAR STRENGTH; INTERFACIAL REACTIONS; LEAD-FREE SOLDER; UNDER BUMP METALLURGY (UBM);

SOLDERED JOINTS;

EID: 4944232620     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-004-0021-1     Document Type: Article

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