Low cost flip chip bumping

International Symposium on Electronic Materials and Packaging, EMAP 2000

Volumn , Issue , 2000, Pages 72-78

  Oppert, Thomas ^a   Teutsch, Thorsten ^a   Zakel, Elke ^a  

^a Pac Tech Packaging Technologies GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; COSTS; FLIP CHIP DEVICES; MODIFIED ATMOSPHERE PACKAGING; SOLDERING; SOLDERING ALLOYS;

DRIVING FORCES; ELECTROLESS COPPER; ELECTROLESS NI; FLIP CHIP TECHNOLOGIES; FLIP-CHIP BUMPING; REDISTRIBUTION PROCESS; UNDER BUMP METALLIZATION; WAFER LEVEL CSP;

COST REDUCTION;

EID: 14844299153     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2000.904135     Document Type: Conference Paper

References (12)

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2. L. F. Miller, " Controlled Collapse After Reflow Chip Joining", IBM J. Res. Develop., Vol. 13, pp. 239-250, May, 1969.
3. T. Oppert, T. Teutsch, E. Zakel, D. Tovar, "A Bumping Process for 12th Wafers", Proceedings of the International Electronics Manufacturing Technology Symposium (24th IEMT), Austin TX, pp. 328-333, October 18-19, 1999
4. T. Oppert, E. Zakel, T. Teutsch, "A Roadmap to Low Cost Flip Chip and CSP using Electroless Ni/Au", Proceedings of the International Electronics Manufacturing Technology Symposium (IEMT) Symposium, Omiya, Japan, April 15-17, 1998
5. M. Vrana, J. De Baets, A. Van Calster, D. Wojciechowski, A. Ostmann, H. Reichl, " An Anisotropic Adhesive Flip Chip Technology for LCD Drivers", Proceedings of the SID Conference 1996
6. R. Heinz, E. Klusmann, H. Meyer, R. Schulz, "PECVD of transition metals for the production of high-density circuits", Surface and Coatings Technology 116-119 (1999) 886-890.
7. Pac Tech Webpage: www.pactech.de
8. P. Kasulke, W. Schmidt, L. Titerle, H. Bohnaker, T. Oppert, E. Zakel, "Solder Ball Bumper SB2-A flexible manufacturing tool for 3-dimensional sensor and microsystem packages", Proceedings of the International Electronics Manufacturing Technology Symposium (22nd IEMT), Berlin, April 27-29, 1998
9. G. Azdasht, L. Titerle, H. Bohnaker, P. Kasulke, E. Zakel, "Ball Bumping for Wafer Level CSP-Yield Study of Laser Reflow and IR-Oven Reflow", Proceedings of the Chip Scale International, San Jose CA, September 14-15, 1999
10. T. Teutsch, T. Oppert, E. Zakel, E. Klusmann, H. Meyer, R. Schulz, J. Schulze "Wafer Level CSP using Low Cost Electroless Redistribution Layer", Proceedings of the 2000 Electronic Components and Technology Conference (50th ECTC), May 21-24, 2000
11. P. Kasulke et al., "Solder Ball Bumping (SBB)-A Flexible Equipment for FC, CSP and BGA", Proceedings of the International Flip Chip, Ball Grid Array, TAB and Advanced Packaging Symposium" (ITAP), San Jose, February 18-19, 1997
12. T. Oppert, T. Teutsch, E. Zakel, G. Azdasht "Single and Multiple Solder Ball Placement and Reflow for Wafer Level CSP", Proceedings of the 2000 International Symposium on Microelectronics (IMAPS), September 20-22, 2000, Boston MA, pp. 43-49