Die stress characterization in flip chip on laminate assemblies

IEEE Transactions on Components and Packaging Technologies

Volumn 28, Issue 3, 2005, Pages 415-429

  Rahim, M Kaysar ^a   Suhling, Jeffrey C ^a   Copeland, D Scott ^b   Islam, M Saiful ^a   Jaeger, Richard C ^a   Lall, Pradeep ^a   Johnson, R Wayne ^a  

^a AUBURN UNIVERSITY   (United States)

^b BOEING COMPANY   (United States)

Author keywords

Curing stresses; Die stress; Flip chip; Piezoresistive sensor; Test chip

Indexed keywords

COMPUTER SIMULATION; FLIP CHIP DEVICES; STRESS ANALYSIS; STRESS CONCENTRATION; THERMAL STRESS;

CURING STRESSES; DIE STRESS; PIEZORESISTIVE SENSOR; TEST CHIP;

CHIP SCALE PACKAGES;

EID: 27644466411     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2005.854303     Document Type: Article

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