The van der pauw stress sensor

IEEE Sensors Journal

Volumn 6, Issue 2, 2006, Pages 340-355

  Mian, Ahsan ^a,b,d,e,f   Suhling, Jeffrey C ^a,c,d,g,h   Jaeger, Richard C ^a,c,f  

^a IEEE   (United States)

^b Montana State University   (United States)

^c AUBURN UNIVERSITY   (United States)

^d ASME   (Japan)

^e Society for Experimental Mechanics   (United States)

^f Society for Experimental Mechanics ^*  (Italy)

^g International Microelectronics Packaging Society (IMAPS)   (United States)

^h Surface Mount Technology Association (SMTA)   (United States)

Author keywords

Piezoresistance; Silicon sensor; Stress sensor; Stress test chip; Van der pauw (VDP) structure

Indexed keywords

PIEZORESISTANCE; SILICON SENSOR; STRESS SENSOR; STRESS TEST CHIP; VAN DER PAUW (VDP) STRUCTURE;

COMPUTER SIMULATION; FABRICATION; INTEGRATED CIRCUIT LAYOUT; PIEZOELECTRIC DEVICES; RESISTORS; SILICON;

SENSORS;

EID: 33645139629     PISSN: 1530437X     EISSN: None     Source Type: Journal    
DOI: 10.1109/JSEN.2006.870140     Document Type: Article

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