Examination of mechanical stresses in silicon substrates due to lead-tin solder bumps via micro-Raman spectroscopy and finite element modelling

Semiconductor Science and Technology

Volumn 17, Issue 12, 2002, Pages 1255-1260

  Kanatharana, J ^a   Perez Camacho J J ^b   Buckley, T ^b   McNally, P J ^a   Tuomi, T ^c   Riikonen, J ^c   Danilewsky, A N ^d   O'Hare, M ^a   Lowney, D ^a   Chen, W ^a   Rantamaki R ^c   Knuuttila, L ^c  

^a DUBLIN CITY UNIVERSITY   (Ireland)

^b Leixlip House Hotel   (Ireland)

^c AALTO UNIVERSITY   (Finland)

^d NONE

Author keywords

[No Author keywords available]

Indexed keywords

COST EFFECTIVENESS; FINITE ELEMENT METHOD; METALLIZING; MICROELECTRONICS; RAMAN SPECTROSCOPY; SOLDERING; STRAIN; STRESSES; SUBSTRATES;

SILICON SUBSTRATES;

SEMICONDUCTING SILICON;

EID: 0036901839     PISSN: 02681242     EISSN: None     Source Type: Journal    
DOI: 10.1088/0268-1242/17/12/308     Document Type: Article

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