A review of first level interconnect modeling methodology

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2006, Pages 529-533

  Dimagiba, Richard Raymond ^a   Ganapathysubramanian, Shankar ^a   Modi, Mitul ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHLORINE COMPOUNDS; DIELECTRIC FILMS; DIELECTRIC MATERIALS; DIES; LEAD; MICROELECTRONICS; MOLECULAR BEAM EPITAXY; NUMERICAL ANALYSIS; PACKAGING MATERIALS; RISK ANALYSIS; RISK MANAGEMENT; SAFETY ENGINEERING; STRESSES; TECHNOLOGY;

DESIGN COMPLEXITIES; DESIGN IMPROVEMENTS; ELECTRONICS MANUFACTURING; FAILURE MECHANISMS; INDUCED STRESSES; INTER-LAYER DIELECTRIC MATERIALS; INTERCONNECT MODELING; INTERNATIONAL CONFERENCES; LEAD-FREE SOLDERING; LOW-K DIELECTRIC FILMS; MECHANICAL PACKAGING; MICROELECTRONICS INDUSTRY; MODELING METHODOLOGIES; NEW DESIGN; PARADIGM SHIFTS;

RISK ASSESSMENT;

EID: 50249176423     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMT.2006.4456507     Document Type: Conference Paper

References (5)

1. L. Garner, S. Sane, et. al., "Finding solutions to the challenges in package interconnect reliability", Intel Technology Journal, Vol. 9, Issue 4, 2005.
2. V. Wakharkar, C. Matayabas, et. al., "Electronic package technology development", Intel Technology Journal, Vol. 9, Issue 4, 2005.
3. S. Ganapathysubramanian, R. Harries, et. al., "On the use of Raven3D tool for improved representation of package structures and its impact on understanding key failure modes," in Proc. Intel Assembly and Test Technology Journal, yet to be published.
4. H. Dongming, C. Zhang, et. al., "Comparison of thin film cracking and delamination for aluminum and copper silicon interconnects with organic packaging", in Proc. IEEE Electronic Components and Technol. Conf. (ECTC), 31 May - 3 June 2005, pp. 349-355. Vol 1, 2005.
5. D. Broek, The Practical Use of Fracture Mechanics, Kluwer Academic Publishers, London, 1989.