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Volumn , Issue , 2007, Pages 17-1-17-55

Chemical-mechanical polishing

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EID: 78649383981     PISSN: None     EISSN: None     Source Type: Book    
DOI: None     Document Type: Chapter
Times cited : (1)

References (153)
  • 4
    • 0345666984 scopus 로고    scopus 로고
    • The Early Days of CMP
    • Fury, M. “The Early Days of CMP” Solid State Technol. 40-5 (1997): 81–86.
    • (1997) Solid State Technol , vol.40 , pp. 81-86
    • Fury, M.1
  • 5
    • 0021405353 scopus 로고
    • CVD Tungsten—A Solution for the Poor Step Coverage and High Contact Resistance of Aluminum
    • Brors, D. L., K. A. Monnig, J. A. Fair, W. Coney, and K. C. Saraswat. “CVD Tungsten—A Solution for the Poor Step Coverage and High Contact Resistance of Aluminum” Solid State Technol. 27 (1982): 313.
    • (1982) Solid State Technol , vol.27 , pp. 313
    • Brors, D.L.1    Monnig, K.A.2    Fair, J.A.3    Coney, W.4    Saraswat, K.C.5
  • 13
    • 25144436315 scopus 로고    scopus 로고
    • Cu Planarization for ULSI Processing by Electrochemical Methods: A Review
    • Suni, I. I., and B. Du. “Cu Planarization for ULSI Processing by Electrochemical Methods: A Review” IEEE Trans. Semicond. Manufact. 18, no. 3 (2005): 341–349.
    • (2005) IEEE Trans. Semicond. Manufact , vol.18 , Issue.3 , pp. 341-349
    • Suni, I.I.1    Du, B.2
  • 14
    • 0001611894 scopus 로고
    • The Theory and Design of Plate Glass Polishing Machines
    • Preston, F. W. “The Theory and Design of Plate Glass Polishing Machines” J. Soc Glass Technol. 11 (1927): 214–254.
    • (1927) J. Soc Glass Technol , vol.11 , pp. 214-254
    • Preston, F.W.1
  • 15
    • 0035338991 scopus 로고    scopus 로고
    • Material Removal Mechanism in Chemical Mechanical Polishing: Theory and Modeling
    • Luo, J., and D. A. Dornfeld. “Material Removal Mechanism in Chemical Mechanical Polishing: Theory and Modeling” IEEE Trans. Semicond. Manufact. 14, no. 2 (2001): 112.
    • (2001) IEEE Trans. Semicond. Manufact , vol.14 , Issue.2 , pp. 112
    • Luo, J.1    Dornfeld, D.A.2
  • 24
    • 85056931950 scopus 로고    scopus 로고
    • Inc. Forest Grove Rd., Furlong, PA
    • TBW Industries, Inc. Forest Grove Rd., Furlong, PA 18925.
  • 33
    • 85056980024 scopus 로고    scopus 로고
    • Sunnyvale, CA
    • Nova Measuring Instruments Inc., 1250 Oakmead Parkway, suite 210, Sunnyvale, CA 94088-3599.
    • Oakmead Parkway, Suite 210 , pp. 1250
  • 36
    • 85056982824 scopus 로고    scopus 로고
    • Bellevue Road, Newark, DE
    • Rohm and Haas Corporation, 451 Bellevue Road, Newark, DE 19713.
  • 50
    • 0030197845 scopus 로고    scopus 로고
    • Stabilization of Alumina Slurries for Chemical–Mechanical Polishing of Copper
    • Luo, Q., D. Campbell, and S. V. Babu. “Stabilization of Alumina Slurries for Chemical–Mechanical Polishing of Copper” Langmuir 12 (1996): 3563.
    • (1996) Langmuir , vol.12 , pp. 3563
    • Luo, Q.1    Campbell, D.2    Babu, S.V.3
  • 51
    • 0031367264 scopus 로고    scopus 로고
    • Chemical–Mechanical Polishing of Copper in Alkaline Media
    • Luo, Q., D. Campbell, and S. V. Babu. “Chemical–Mechanical Polishing of Copper in Alkaline Media” Thin Solid Films 311 (1997): 177.
    • (1997) Thin Solid Films , vol.311 , pp. 177
    • Luo, Q.1    Campbell, D.2    Babu, S.V.3
  • 54
    • 85056933802 scopus 로고    scopus 로고
    • Distribution Systems for CMP: The New Challenge
    • Korman, R., and D. Capitano. “Distribution Systems for CMP: The New Challenge” J. Electron. Mater. 25 (1996): 1608.
    • (1996) J. Electron. Mater , vol.25 , pp. 1608
    • Korman, R.1    Capitano, D.2
  • 57
    • 0001417013 scopus 로고    scopus 로고
    • The Importance of Particle Size to the Performance of the Abrasive Particles in the CMP Process
    • Pohl, M. C., and D. C. Griffiths. “The Importance of Particle Size to the Performance of the Abrasive Particles in the CMP Process” J. Electron. Mater. 25 (1996): 1612.
    • (1996) J. Electron. Mater , vol.25 , pp. 1612
    • Pohl, M.C.1    Griffiths, D.C.2
  • 59
    • 0031920304 scopus 로고    scopus 로고
    • Effect of Slurry Viscosity Modification on Oxide and Tungsten CMP
    • Grover, G. S., H. Liang, S. Ganeshkumar, and W. Fortino. “Effect of Slurry Viscosity Modification on Oxide and Tungsten CMP” Wear 214 (1998): 10.
    • (1998) Wear , vol.214 , pp. 10
    • Grover, G.S.1    Liang, H.2    Ganeshkumar, S.3    Fortino, W.4
  • 62
    • 0031235830 scopus 로고    scopus 로고
    • Monitoring Slurry Stability to Reduce Process Variability
    • Bare, J., and T. Lemke. “Monitoring Slurry Stability to Reduce Process Variability” Micro (1997): 53.
    • (1997) Micro , pp. 53
    • Bare, J.1    Lemke, T.2
  • 63
    • 85056982812 scopus 로고    scopus 로고
    • Can CMP Waste Ever Be Environmentally Friendly?
    • Corlett, G. “Can CMP Waste Ever Be Environmentally Friendly?” J. Adv. Appl. Contam. Control. 1-11 (1998): 19.
    • (1998) J. Adv. Appl. Contam. Control , vol.11 , pp. 19
    • Corlett, G.1
  • 64
    • 0032099121 scopus 로고    scopus 로고
    • The Environmental, Health and Safety Side of Copper Metallization
    • Mendocino, L., and P. T. Brown. “The Environmental, Health and Safety Side of Copper Metallization” Semicond. Int. (1998): 105.
    • (1998) Semicond. Int , pp. 105
    • Mendocino, L.1    Brown, P.T.2
  • 65
    • 0022864698 scopus 로고
    • Preparation of Ultrasmooth Surfaces
    • Brown, N. “Preparation of Ultrasmooth Surfaces” Ann. Rev. Mater. Sci. 16 (1986): 371–388.
    • (1986) Ann. Rev. Mater. Sci , vol.16 , pp. 371-388
    • Brown, N.1
  • 66
    • 0020253224 scopus 로고
    • Optical Polishing of Metals
    • Brown, N., P. Baker, and R. Maney. “Optical Polishing of Metals” Proc. SPIE 306 (1981): 42–57.
    • (1981) Proc. SPIE , vol.306 , pp. 42-57
    • Brown, N.1    Baker, P.2    Maney, R.3
  • 68
    • 0029375964 scopus 로고
    • Characterization Pf the Chemical–Mechanical Polishing Process Based on Nanoindentaation Measrement of Dielectric Films
    • Liu, C. W., B. T. Dai, and C. F. Yeh. “Characterization Pf the Chemical–Mechanical Polishing Process Based on Nanoindentaation Measrement of Dielectric Films” J. Electrochem. Soc 142 (1995): 3098–3104.
    • (1995) J. Electrochem. Soc , vol.142 , pp. 3098-3104
    • Liu, C.W.1    Dai, B.T.2    Yeh, C.F.3
  • 69
    • 0030086567 scopus 로고    scopus 로고
    • Modeling of the Wear Mechanism during Chemical–Mechanical Polishing
    • Liu, C. W., B. T. Dai, W. T. Tseng, and C. F. Yeh. “Modeling of the Wear Mechanism during Chemical–Mechanical Polishing” J. Electrochem. Soc 143 (1996): 716.
    • (1996) J. Electrochem. Soc , vol.143 , pp. 716
    • Liu, C.W.1    Dai, B.T.2    Tseng, W.T.3    Yeh, C.F.4
  • 71
    • 0028444787 scopus 로고
    • Tribology Analysis of Chemical–Mechanical Polishing
    • Runnels, S. R., and L. M. Eyman. “Tribology Analysis of Chemical–Mechanical Polishing” J. Electrochem. Soc 141 (1994): 1698–1701.
    • (1994) J. Electrochem. Soc , vol.141 , pp. 1698-1701
    • Runnels, S.R.1    Eyman, L.M.2
  • 72
    • 0031075324 scopus 로고    scopus 로고
    • Re-Examination of Pressure and Speed Dependance of Removal Rates during Chemical–Mechanical Polishing Processes
    • Tseng, W. T., and Y. L. Wang. “Re-Examination of Pressure and Speed Dependance of Removal Rates during Chemical–Mechanical Polishing Processes” J. Electrochem. Soc 144 (1997): L15–L17.
    • (1997) J. Electrochem. Soc , vol.144 , pp. L15-L17
    • Tseng, W.T.1    Wang, Y.L.2
  • 73
    • 0032139417 scopus 로고    scopus 로고
    • Modeling of Chemical–Mechanical Polishing with Soft Pads
    • Shi, F. G., and B. Zhao. “Modeling of Chemical–Mechanical Polishing with Soft Pads” Appl. Phys. A 67 (1998): 249–252.
    • (1998) Appl. Phys. A , vol.67 , pp. 249-252
    • Shi, F.G.1    Zhao, B.2
  • 75
    • 0033101768 scopus 로고    scopus 로고
    • Chemical Mechanical Polishing: Threshold Pressure and Mechanism
    • Zhao, B., and F. G. Shi. “Chemical Mechanical Polishing: Threshold Pressure and Mechanism” Electrochem. Solid State Lett. 2 (1999): 145–147.
    • (1999) Electrochem. Solid State Lett , vol.2 , pp. 145-147
    • Zhao, B.1    Shi, F.G.2
  • 80
    • 0031100738 scopus 로고    scopus 로고
    • Van Mises Stress in Chemical– Mechanical Polishing Processes
    • Wang, J. L., K. Holland, T. Bibby, S. Beaudoin, and T. Cale. “Van Mises Stress in Chemical– Mechanical Polishing Processes” J. Electrochem. Soc 144 (1997): 1121–1127.
    • (1997) J. Electrochem. Soc , vol.144 , pp. 1121-1127
    • Wang, J.L.1    Holland, K.2    Bibby, T.3    Beaudoin, S.4    Cale, T.5
  • 83
    • 0026204737 scopus 로고
    • A Two-Dimensional Process Model for Chemimechanical Polish Planarizaton
    • Warnock, J. “A Two-Dimensional Process Model for Chemimechanical Polish Planarizaton” J. Electrochem. Soc 138 (1991): 2398–2402.
    • (1991) J. Electrochem. Soc , vol.138 , pp. 2398-2402
    • Warnock, J.1
  • 84
    • 0028465918 scopus 로고
    • Feature-Scale Fluid-Based Erosion Modeling for Chemical–Mechanical Polishing
    • Runnels, S. R. “Feature-Scale Fluid-Based Erosion Modeling for Chemical–Mechanical Polishing” J. Electrochem. Soc 141 (1994): 1900–1904.
    • (1994) J. Electrochem. Soc , vol.141 , pp. 1900-1904
    • Runnels, S.R.1
  • 87
    • 0032099606 scopus 로고    scopus 로고
    • Wear-Contact Problems and Modeling of Chemical Mechanical Polishing
    • Chekina, O. G., L. M. Keer, and H. Liang. “Wear-Contact Problems and Modeling of Chemical Mechanical Polishing” J. Electrochem. Soc 145 (1998): 2100–2106.
    • (1998) J. Electrochem. Soc , vol.145 , pp. 2100-2106
    • Chekina, O.G.1    Keer, L.M.2    Liang, H.3
  • 90
    • 0031077147 scopus 로고    scopus 로고
    • Analysis and Decomposition of Spatial Variation in Integrated Circuits Processes and Devices
    • Stine, B. E., D. S. Boning, and J. E. Chung. “Analysis and Decomposition of Spatial Variation in Integrated Circuits Processes and Devices” IEEE Trans. Semicond. Manufact. 10 (1997): 24–41.
    • (1997) IEEE Trans. Semicond. Manufact , vol.10 , pp. 24-41
    • Stine, B.E.1    Boning, D.S.2    Chung, J.E.3
  • 98
    • 0028516105 scopus 로고
    • Pattern Geometry Effects in the Chemical–Mechanical Polishing of Inlaid Copper Structures
    • Steigerwald, J. M., R. Zirpoli, S. P. Murarka, D. Price, and R. J. Gutmann. “Pattern Geometry Effects in the Chemical–Mechanical Polishing of Inlaid Copper Structures” J. Electrochem. Soc 141 (1994): 2842.
    • (1994) J. Electrochem. Soc , vol.141 , pp. 2842
    • Steigerwald, J.M.1    Zirpoli, R.2    Murarka, S.P.3    Price, D.4    Gutmann, R.J.5
  • 100
    • 0025417082 scopus 로고
    • Chemical Processes in Glass Polishing
    • Cook, L. “Chemical Processes in Glass Polishing” J. Non-Cryst. Solids 120 (1990): 152–171.
    • (1990) J. Non-Cryst. Solids , vol.120 , pp. 152-171
    • Cook, L.1
  • 101
    • 0021450042 scopus 로고
    • Diffusion of Water in High Silica Glasses as Low Temperature
    • Nogami, M., and M. Tomozawa. “Diffusion of Water in High Silica Glasses as Low Temperature” Phys. Chem. Glass. 25 (1984): 82–85.
    • (1984) Phys. Chem. Glass , vol.25 , pp. 82-85
    • Nogami, M.1    Tomozawa, M.2
  • 104
    • 0033101767 scopus 로고    scopus 로고
    • Chemical Mechanical Polishing of Tungsten: Effect of Tungstate Ion on the Electrochemical Behavior of Tungsten
    • Osseo-Asare, K., M. Anik, and J. DeSimone. “Chemical Mechanical Polishing of Tungsten: Effect of Tungstate Ion on the Electrochemical Behavior of Tungsten” Electrochem. Solid State Lett. 2 (1999): 143–144.
    • (1999) Electrochem. Solid State Lett , vol.2 , pp. 143-144
    • Osseo-Asare, K.1    Anik, M.2    Desimone, J.3
  • 106
    • 0029389318 scopus 로고
    • Initial Study on Copper CMP Slurry Chemistries
    • Carpio, R., J. Farkas, and R. Jairath. “Initial Study on Copper CMP Slurry Chemistries” Thin Solid Films 266 (1995): 238–244.
    • (1995) Thin Solid Films , vol.266 , pp. 238-244
    • Carpio, R.1    Farkas, J.2    Jairath, R.3
  • 109
    • 0001547456 scopus 로고
    • Dishing Effects in a Chemical–Mechanical Polishing Planarization Process for Advanced Trench Isolation
    • Yu, C., C. Fazan, V. Matthews, and T. Doan. “Dishing Effects in a Chemical–Mechanical Polishing Planarization Process for Advanced Trench Isolation” Appl. Phys. Lett. 61 (1992): 1344.
    • (1992) Appl. Phys. Lett , vol.61 , pp. 1344
    • Yu, C.1    Fazan, C.2    Matthews, V.3    Doan, T.4
  • 110
    • 0024895494 scopus 로고
    • A New Planarization Technique Using a Combination of RIE and Chemical Mechanical Polish (CMP)
    • Davari, B., C. Koburger, R. Schulz, J. Warnock, T. Furukawa, M. Jost, Y. Taur, et al. “A New Planarization Technique Using a Combination of RIE and Chemical Mechanical Polish (CMP)” IEDM Tech. Dig. (1989): 61–64.
    • (1989) IEDM Tech. Dig , pp. 61-64
    • Davari, B.1    Koburger, C.2    Schulz, R.3    Warnock, J.4    Furukawa, T.5    Jost, M.6    Taur, Y.7
  • 112
    • 0029376264 scopus 로고
    • Optimization of a Shallow Trench Isolation Process for Improved Planarization
    • Cooperman, S., A. Nasar, and G. Grula. “Optimization of a Shallow Trench Isolation Process for Improved Planarization” J. Electrochem. Soc 142 (1995): 3180–3185.
    • (1995) J. Electrochem. Soc , vol.142 , pp. 3180-3185
    • Cooperman, S.1    Nasar, A.2    Grula, G.3
  • 116
    • 84889545994 scopus 로고
    • A One-Step Shallow Trench Global Planarization Process Using Chemical Mechanical Polishing
    • Boyd, J., and J. Ellul. “A One-Step Shallow Trench Global Planarization Process Using Chemical Mechanical Polishing” Electrochem. Soc Proc. (1995): 290–301.
    • (1995) Electrochem. Soc Proc , pp. 290-301
    • Boyd, J.1    Ellul, J.2
  • 121
    • 0032028732 scopus 로고    scopus 로고
    • The Physical and Electrical Effects of Metal-Fill Patterning Practices for Oxide Chemical–Mechanical Polishing Processes
    • Stine, B., D. Boning, J. Chung, L. Camilletti, F. Kruppa, E. Equi, W. Loh, et al. “The Physical and Electrical Effects of Metal-Fill Patterning Practices for Oxide Chemical–Mechanical Polishing Processes” IEEE Trans. Electron. Dev. 45 (1998): 665–679.
    • (1998) IEEE Trans. Electron. Dev , vol.45 , pp. 665-679
    • Stine, B.1    Boning, D.2    Chung, J.3    Camilletti, L.4    Kruppa, F.5    Equi, E.6    Loh, W.7
  • 124
    • 0031190401 scopus 로고    scopus 로고
    • High Aspect Ratio Contacts: A Review of the Current Tungsten Plug Process
    • Ireland, P. J. “High Aspect Ratio Contacts: A Review of the Current Tungsten Plug Process” Thin Solid Films 304 (1997): 1–12.
    • (1997) Thin Solid Films , vol.304 , pp. 1-12
    • Ireland, P.J.1
  • 125
    • 0027559592 scopus 로고
    • Corrosion and Protection of Thin-Line Conductors in VLSI Structures
    • Brusic, V., G. S. Frankel, C.-K. Hu, M. M. Plechaty, and G. C. Scwartz. “Corrosion and Protection of Thin-Line Conductors in VLSI Structures” IBM J. Res. Dev. 37, no. 2 (1993): 173.
    • (1993) IBM J. Res. Dev , vol.37 , Issue.2 , pp. 173
    • Brusic, V.1    Frankel, G.S.2    Hu, C.-K.3    Plechaty, M.M.4    Scwartz, G.C.5
  • 127
    • 0015416303 scopus 로고
    • Structure of Electroplated and Vapor-Deposited Copper Films. II. Effects of Annealing
    • Gangulee, A. “Structure of Electroplated and Vapor-Deposited Copper Films. II. Effects of Annealing” J. Appl. Phys. 43 (1972): 3943.
    • (1972) J. Appl. Phys , vol.43 , pp. 3943
    • Gangulee, A.1
  • 128
    • 0032686792 scopus 로고    scopus 로고
    • The Impact of Linewidth and Line Density on the Texture of Electroplated Cu in Damascene-Fabricated Lines
    • Vanasupa, L., D. Pinck, Y.-C. Joo, T. Nogami, S. Pramanick, S. Lopatin, and K. Yang. “The Impact of Linewidth and Line Density on the Texture of Electroplated Cu in Damascene-Fabricated Lines” Electrochem. Solid State Lett. 2, no. 6 (1999): 329.
    • (1999) Electrochem. Solid State Lett , vol.2 , Issue.6 , pp. 329
    • Vanasupa, L.1    Pinck, D.2    Joo, Y.-C.3    Nogami, T.4    Pramanick, S.5    Lopatin, S.6    Yang, K.7
  • 129
    • 0343286458 scopus 로고    scopus 로고
    • Copper vs Aluminum: A Planarization Perspective
    • Sethuraman, A. R., J.-F. Wang, and L. M. Cook. “Copper vs Aluminum: A Planarization Perspective” Semicond. Int. (1996): 177.
    • (1996) Semicond. Int , pp. 177
    • Sethuraman, A.R.1    Wang, J.-F.2    Cook, L.M.3
  • 130
    • 0037598472 scopus 로고
    • Chemical– Mechanical Polishing of Dual Damascene Aluminum Interconnect Structures
    • Wang, J.-F., A. R. Sethuraman, L. M. Cook, R. C. Kistler, and G. P. Schwartz. “Chemical– Mechanical Polishing of Dual Damascene Aluminum Interconnect Structures” Semicond. Int. (1995): 117–122.
    • (1995) Semicond. Int , pp. 117-122
    • Wang, J.-F.1    Sethuraman, A.R.2    Cook, L.M.3    Kistler, R.C.4    Schwartz, G.P.5
  • 131
    • 0032476325 scopus 로고    scopus 로고
    • Material Characteristics, Chemical– Mechanical Polishing of Aluminum Alloy Thin Films
    • Wang, Y. L., J. Wu, C. W. Liu, T. C. Wang, and J. Dun. “Material Characteristics, Chemical– Mechanical Polishing of Aluminum Alloy Thin Films” Thin Solid Films 332 (1998): 397–403.
    • (1998) Thin Solid Films , vol.332 , pp. 397-403
    • Wang, Y.L.1    Wu, J.2    Liu, C.W.3    Wang, T.C.4    Dun, J.5
  • 132
    • 0029324044 scopus 로고
    • Mechanical Brush Scrubbing for Post-CMP Clean
    • Krussel, W. C., J. M. deLarios, and J. Zhang. “Mechanical Brush Scrubbing for Post-CMP Clean” Solid State Technol. 38, no. 6 (1995): 109.
    • (1995) Solid State Technol , vol.38 , Issue.6 , pp. 109
    • Krussel, W.C.1    Delarios, J.M.2    Zhang, J.3
  • 134
    • 0030259176 scopus 로고    scopus 로고
    • Using Double-Sided Scrubbing Systems for Multiple General Fab Applications
    • Hymes, D. J., and I. J. Malik. “Using Double-Sided Scrubbing Systems for Multiple General Fab Applications” Micro 14 (1996): 7.
    • (1996) Micro , vol.14 , pp. 7
    • Hymes, D.J.1    Malik, I.J.2
  • 138
    • 0022029193 scopus 로고
    • Megasonic Particle Removal from Solid-State Wafers
    • Shwartzman, S., A. Mayer, and W. Kern. “Megasonic Particle Removal from Solid-State Wafers” RCA Rev. 46-3 (1985): 81.
    • (1985) RCA Rev , vol.3-46 , pp. 81
    • Shwartzman, S.1    Mayer, A.2    Kern, W.3
  • 139
    • 0032300217 scopus 로고    scopus 로고
    • Effects of Post Chemical Mechanical Planarization Buffing on Defect Density of Tungsten and Oxide Wafers
    • Shen, J. J., W. D. Costas, L. M. Cook, and J. Farber. “Effects of Post Chemical Mechanical Planarization Buffing on Defect Density of Tungsten and Oxide Wafers” J. Electrochem. Soc 145 (1998): 4240–4243.
    • (1998) J. Electrochem. Soc , vol.145 , pp. 4240-4243
    • Shen, J.J.1    Costas, W.D.2    Cook, L.M.3    Farber, J.4
  • 140
    • 0028517258 scopus 로고
    • Investigating the Effect of Secondary Platen Pressure on Post- Chemical–Mechanical Planarization Cleaning
    • Ali, I., S. R. Roy, and G. B. Shinn. “Investigating the Effect of Secondary Platen Pressure on Post- Chemical–Mechanical Planarization Cleaning” Microcontamination 12-10 (1994): 45–50.
    • (1994) Microcontamination , vol.12-10 , pp. 45-50
    • Ali, I.1    Roy, S.R.2    Shinn, G.B.3
  • 141
    • 0026961639 scopus 로고
    • Electrical Properties of Chemical–Mechanical Polished Tetraethyl Orthosilicate Films with and Without Capping Layers
    • Cohen, S. A., M. A. Jaso, and A. A. Bright. “Electrical Properties of Chemical–Mechanical Polished Tetraethyl Orthosilicate Films with and Without Capping Layers” J. Electrochem. Soc 139 (1992): 3572–3574.
    • (1992) J. Electrochem. Soc , vol.139 , pp. 3572-3574
    • Cohen, S.A.1    Jaso, M.A.2    Bright, A.A.3
  • 144
    • 0028497652 scopus 로고
    • Near Surface Modification of Silica Structure Induced by Chemical/Mechanical Polishing
    • Trogolo, J. A., and K. Rajan. “Near Surface Modification of Silica Structure Induced by Chemical/Mechanical Polishing” J. Mat. Sci. 29 (1994): 4548–4554.
    • (1994) J. Mat. Sci , vol.29 , pp. 4548-4554
    • Trogolo, J.A.1    Rajan, K.2
  • 148
    • 0030871139 scopus 로고    scopus 로고
    • Corrosion Protection ofCopper by a Self-Assembled Monolayer of Alkanethiol
    • Feng, Y., W.-K. Teo, K.-S. Siow, Z. Gao, K.-L. Tan, and A.-K. Hsieh. “Corrosion Protection ofCopper by a Self-Assembled Monolayer of Alkanethiol” J. Electrochem. Soc 144 (1997): 55–64.
    • (1997) J. Electrochem. Soc , vol.144 , pp. 55-64
    • Feng, Y.1    Teo, W.-K.2    Siow, K.-S.3    Gao, Z.4    Tan, K.-L.5    Hsieh, A.-K.6
  • 149
    • 0031251007 scopus 로고    scopus 로고
    • Effects of Corrosion Environments on the Surface Finishing of Copper Chemical Mechanical Polishing
    • Wang, M. T., M. S. Tsai, C. Liu, W. T. Tseng, T. C. Chang, L. J. Chen, and M. C. Chen. “Effects of Corrosion Environments on the Surface Finishing of Copper Chemical Mechanical Polishing” Thin Solid Films 308–309 (1997): 520–522.
    • (1997) Thin Solid Films , vol.308-309 , pp. 520-522
    • Wang, M.T.1    Tsai, M.S.2    Liu, C.3    Tseng, W.T.4    Chang, T.C.5    Chen, L.J.6    Chen, M.C.7
  • 150
    • 0032022944 scopus 로고    scopus 로고
    • Aqueous Potential-pH Equilibria in Copper-Benzotriazole Systems
    • Tromans, D. “Aqueous Potential-pH Equilibria in Copper-Benzotriazole Systems” J. Electrochem. Soc 145 (1998): L43–L45.
    • (1998) J. Electrochem. Soc , vol.145 , pp. L43-L45
    • Tromans, D.1
  • 151
    • 0031999802 scopus 로고    scopus 로고
    • Influence of Initial Wafer Cleanliness on Metal Removal Efficiency in Immersion SC-1 Cleaning: Limitation of Immersion-Type Wet Cleaning, IEEE Trans
    • Osaka, T., and T. Hattori. “Influence of Initial Wafer Cleanliness on Metal Removal Efficiency in Immersion SC-1 Cleaning: Limitation of Immersion-Type Wet Cleaning, IEEE Trans” Semicond. Manufcat. 11, no. 1 (1998): 20–24.
    • (1998) Semicond. Manufcat , vol.11 , Issue.1 , pp. 20-24
    • Osaka, T.1    Hattori, T.2


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