A modeling tool for chemical-mechanical polishing design and evaluation

IEEE Transactions on Semiconductor Manufacturing

Volumn 11, Issue 3, 1998, Pages 501-510

  Runnels, Scott R ^a   Kim, Inki ^b   Schleuter, Jim ^b   Karlsrud, Chris ^b   Desai, Mukesh ^c  

^a SOUTHWEST RESEARCH INSTITUTE   (United States)

^b SpeedFam IPEC   (United States)

^c Challenger Worldwide Corporation   (United States)

Author keywords

Chemical mechanical polishing (CMP); Model validation; Modeling; Software

Indexed keywords

ALGORITHMS; CHEMICAL POLISHING; COMPUTER AIDED MANUFACTURING; OPTIMIZATION; PROCESS CONTROL; SEMICONDUCTOR DEVICE MODELS;

CHEMICAL MECHANICAL PROCESSING (CMP); LEVENBERG-MARQUART MINIMIZATION; SOFTWARE PACKAGE PLANE VIEW;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0032136169     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/66.705385     Document Type: Review

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